multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro MP008827

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro - 25AK3578 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro
25AK3578
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro 25AK3578
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3578
Product Name Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
Low oil-bleed processor cooling gel - SE35 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Highly Conformable and Non-Flammable 13-Watt Thermal Gap Filler - SARCON®PG130A - Fujipoly® America Corp.
Specs
Type High Dielectric
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0787 inch (0.3000 to 2 mm)
View Details