multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro MP008825

Description

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

Newark, An Avnet Company

Description

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

Suppliers

Company

Product

Description

Supplier Links

Newark, An Avnet Company

Chicago, IL, United States

Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro
25AK3576

Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro 25AK3576

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

	Newark, An Avnet Company
Product Category	Thermal Compounds and Thermal Interface Materials
Product Number	25AK3576
Product Name	Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro

Unlock Full Specs

to access all available technical data

Similar Products

ELANTAS North America LLC

Pedigree®

40 VTC-40F

Specs

Type High Dielectric

Cure / Technology Thermoset; Single Component

Form / Shape Liquid

View Details

Quantaflex Printed Electronics Inc.

Thermal Interface Materials

Specs

Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket

Industry Electronics; Semiconductors, IC's

Features EMI/RFI Shielding

View Details

Master Bond, Inc.

One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications

EP17HTND-CCM

Specs

Type High Dielectric

Cure / Technology Thermoset; Single Component

Form / Shape Die Bonding Adhesives; Flowable Paste; Grease, Paste

View Details

Hernon Manufacturing, Inc.

Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D

746D

Specs

Cure / Technology Room Temperature Vulcanizing or Curing

Chemical System Silicone

Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

View Details