multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro MP008820

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro - 25AK3571 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro
25AK3571
Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro 25AK3571
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3571
Product Name Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-99 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Thermal Pads - 2457321 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 1000 W/m-K (578 BTU-ft/hr-ft²-F)
View Details
Low Viscosity, Thermally Conductive Underfill Epoxy - EP3UF-1 - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details