multicomp PRO Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro MP008818

Description
THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES
  • Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro - 25AK3569 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro - 25AK3569 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro
25AK3569
Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro 25AK3569
THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3569
Product Name Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-3 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-3
Specs
Cure / Technology Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 850 F (0 to 454 C)
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D
746D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Two-component insulation thermal conductive gel for PCB - SE800AB - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Two-component insulation thermal conductive gel for PCB
SE800AB
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details