multicomp PRO Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro MP008818

Description
THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro - 25AK3569 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro
25AK3569
Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro 25AK3569
THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3569
Product Name Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Flexible thermal conductive insulating film for power semiconductors - SC1000FG - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thermal Pads - 1225192 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 240 W/m-K (139 BTU-ft/hr-ft²-F)
View Details
Graphite Filled, Electrically Conductive Epoxy - EP75-1 - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
View Details