multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro MP008811

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro - 25AK3562 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro
25AK3562
Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro 25AK3562
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3562
Product Name Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Silicone-free thermal pad for medical equipment - AF600 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Highly Thermal Conductive, Electricity Insulative, Low Viscosity Type Silicone Compound - SARCON ® SPG-20A - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details