multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro MP008808

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro - 25AK3559 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro
25AK3559
Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro 25AK3559
THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3559
Product Name Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Thermally Conductive, Dimensionally Stable Epoxy - EP21AO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Form / Shape Liquid; Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket
Chemical System Epoxy
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details