multicomp PRO Thermal Pad, 150Mm X 150Mm X 2Mm, Purple Rohs Compliant Multicomp Pro MP-TG-A4500-150-2.0

Description
THERMAL PAD, 150MM X 150MM X 2MM, PURPLE ROHS COMPLIANT: YES
  • Thermal Pad, 150Mm X 150Mm X 2Mm, Purple Rohs Compliant Multicomp Pro - 49AH9364 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL PAD, 150MM X 150MM X 2MM, PURPLE ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, 150Mm X 150Mm X 2Mm, Purple Rohs Compliant Multicomp Pro - 49AH9364 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, 150Mm X 150Mm X 2Mm, Purple Rohs Compliant Multicomp Pro
49AH9364
Thermal Pad, 150Mm X 150Mm X 2Mm, Purple Rohs Compliant Multicomp Pro 49AH9364
THERMAL PAD, 150MM X 150MM X 2MM, PURPLE ROHS COMPLIANT: YES

THERMAL PAD, 150MM X 150MM X 2MM, PURPLE ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 49AH9364
Product Name Thermal Pad, 150Mm X 150Mm X 2Mm, Purple Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Potting Compound Solutions for PCBAs - Electrolube ® ER2220 Highly Thermally Conductive Epoxy Potting Compound - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Potting Compound Solutions for PCBAs
Electrolube ® ER2220 Highly Thermally Conductive Epoxy Potting Compound
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Industry Electronics; Semiconductors, IC's
View Details
Thermal sil pad for power amplifiers - SC800FG - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal sil pad for power amplifiers
SC800FG
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed - QSil-553 - CHT USA Inc.
CHT USA Inc.
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed
QSil-553
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics; OEM or Industrial
Features Flame Retardant; UL Rating
View Details