multicomp PRO Thermal Pad, 150Mm X 150Mm X 1Mm, Yellow Rohs Compliant Multicomp Pro MP-TG-A3500-150-1.0

Description
THERMAL PAD, 150MM X 150MM X 1MM, YELLOW ROHS COMPLIANT: YES
  • Thermal Pad, 150Mm X 150Mm X 1Mm, Yellow Rohs Compliant Multicomp Pro - 49AH9357 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL PAD, 150MM X 150MM X 1MM, YELLOW ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, 150Mm X 150Mm X 1Mm, Yellow Rohs Compliant Multicomp Pro - 49AH9357 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, 150Mm X 150Mm X 1Mm, Yellow Rohs Compliant Multicomp Pro
49AH9357
Thermal Pad, 150Mm X 150Mm X 1Mm, Yellow Rohs Compliant Multicomp Pro 49AH9357
THERMAL PAD, 150MM X 150MM X 1MM, YELLOW ROHS COMPLIANT: YES

THERMAL PAD, 150MM X 150MM X 1MM, YELLOW ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 49AH9357
Product Name Thermal Pad, 150Mm X 150Mm X 1Mm, Yellow Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
CHT USA Inc.
2-Part, Silicone Potting Compound and Encapsulant, UL Listed
QSil-563
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Advanced Hybrid Sintering Die Attach Solutions - ATROX ® 800HT2V - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Advanced Hybrid Sintering Die Attach Solutions
ATROX ® 800HT2V
Specs
Cure / Technology Thermoset
Form / Shape Die Bonding Adhesives
Industry Electronics; Semiconductors, IC's
View Details
Highly Conformable and Non-Flammable, Higher Thermal interface material - SARCON® PG80B - Fujipoly® America Corp.
Fujipoly® America Corp.
Highly Conformable and Non-Flammable, Higher Thermal interface material
SARCON® PG80B
Specs
Type High Dielectric
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
View Details
Carbon Fiber Thermal Interface Material for LCD and Plasma TVs - CSF15 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Carbon Fiber Thermal Interface Material for LCD and Plasma TVs
CSF15
Specs
Form / Shape Pad
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details