multicomp PRO Insulating Kit; Insulator Body Material Multicomp MK3309

Description
INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; External Depth:12.7mm RoHS Compliant: Yes
Datasheet
Description
INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; External Depth:12.7mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulating Kit; Insulator Body Material Multicomp - 50P9669 - Newark, An Avnet Company
Chicago, IL, United States
Insulating Kit; Insulator Body Material Multicomp
50P9669
Insulating Kit; Insulator Body Material Multicomp 50P9669
INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; External Depth:12.7mm RoHS Compliant: Yes

INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; External Depth:12.7mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 50P9669
Product Name Insulating Kit; Insulator Body Material Multicomp
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
New arrival thermal conductive silicone pad for PCB LED - SF500FG - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details