multicomp PRO Solder Wire, 99.3/0.7 Sn/cu, 500G; Leaded / Lead Free Multicomp 507-1355

Description
SOLDER WIRE, 99.3/0.7 SN/CU, 500G; Leaded / Lead Free:Lead Free; Flux Type:Rosin; Solder Alloy:99.3, 0.7 Sn, Cu; External Diameter - Metric:0.9mm; External Diameter - Imperial:0.035"; Melting Temperature:227°C; Weight - Metric:500g RoHS Compliant: Yes
Description
SOLDER WIRE, 99.3/0.7 SN/CU, 500G; Leaded / Lead Free:Lead Free; Flux Type:Rosin; Solder Alloy:99.3, 0.7 Sn, Cu; External Diameter - Metric:0.9mm; External Diameter - Imperial:0.035"; Melting Temperature:227°C; Weight - Metric:500g RoHS Compliant: Yes
Datasheet
Datasheet Summary
Powered by GS/AI

The Solder Wire, 99.3/0.7 Sn/Cu, 500G from Multicomp is a lead-free solder wire designed for industrial electronic production and rework applications. It features a tin-copper alloy with a rosin flux that is halide activated, ensuring safe soldering even at low temperatures. The solder wire is characterized by its high activity, which facilitates quick spreading and results in solid, dry residues that are pin testable. It conforms to DIN EN 29454-1 type 1.1.2 standards, making it suitable for both hand and robotic soldering in various electronic assemblies, including audio devices and telecommunications. The standard flux content is 2.5% by weight, and while flux residues can remain on surfaces without cleaning, a special aqueous cleaner can be used if necessary.

Datasheet Summary
Powered by GS/AI

The Solder Wire, 99.3/0.7 Sn/Cu, 500G from Multicomp is a lead-free solder wire designed for industrial electronic production and rework applications. It features a tin-copper alloy with a rosin flux that is halide activated, ensuring safe soldering even at low temperatures. The solder wire is characterized by its high activity, which facilitates quick spreading and results in solid, dry residues that are pin testable. It conforms to DIN EN 29454-1 type 1.1.2 standards, making it suitable for both hand and robotic soldering in various electronic assemblies, including audio devices and telecommunications. The standard flux content is 2.5% by weight, and while flux residues can remain on surfaces without cleaning, a special aqueous cleaner can be used if necessary.

Suppliers

Company
Product
Description
Supplier Links
Solder Wire, 99.3/0.7 Sn/cu, 500G; Leaded / Lead Free Multicomp - 15J7250 - Newark, An Avnet Company
Chicago, IL, United States
Solder Wire, 99.3/0.7 Sn/cu, 500G; Leaded / Lead Free Multicomp
15J7250
Solder Wire, 99.3/0.7 Sn/cu, 500G; Leaded / Lead Free Multicomp 15J7250
SOLDER WIRE, 99.3/0.7 SN/CU, 500G; Leaded / Lead Free:Lead Free; Flux Type:Rosin; Solder Alloy:99.3, 0.7 Sn, Cu; External Diameter - Metric:0.9mm; External Diameter - Imperial:0.035"; Melting Temperature:227°C; Weight - Metric:500g RoHS Compliant: Yes

SOLDER WIRE, 99.3/0.7 SN/CU, 500G; Leaded / Lead Free:Lead Free; Flux Type:Rosin; Solder Alloy:99.3, 0.7 Sn, Cu; External Diameter - Metric:0.9mm; External Diameter - Imperial:0.035"; Melting Temperature:227°C; Weight - Metric:500g RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Welding, Brazing, and Soldering Equipment
Product Number 15J7250
Product Name Solder Wire, 99.3/0.7 Sn/cu, 500G; Leaded / Lead Free Multicomp
Unlock Full Specs
to access all available technical data

Similar Products

Carousel Feed Brazing System -  - Inductotherm Group
Specs
Equipment Type Complete System
Process Capability Brazing; Soldering Stations, Irons & Accessories
View Details
Soldering Iron Tips - 115167 - RS Components, Ltd.
Specs
Equipment Type Gun / Iron
Process Capability Soldering Stations, Irons & Accessories
View Details
Socket Welding, Spider ™ Socket Welding Machine -  - Asahi/America, Inc.
Specs
Equipment Type Complete System
Process Capability Welding
View Details
Electron Beam Welder - Model 536 Beamer - Electron Beam Engineering, Inc.
Electron Beam Engineering, Inc.
Specs
Equipment Type Complete System
Process Capability Electron Beam Welding; Welding
Material Capability High Performance Materials Requiring Very Small HAZ
View Details