The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability.
*Gallium-Arsenide requires probe reconfiguration for semi-insulating materials over 10K-Ohm cm bulk resistance
Features
Front USB port enables easy data storage to flash drives
MTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and Dependability
Non-contact Measurements
76-300 mm Diameter Wafer Range
Optional wafer measurement rings
Wafer stops for exact centering
Ethernet interface
Full remote control software (Windows compatible)
Optional calibration wafers
The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability.
*Gallium-Arsenide requires probe reconfiguration for semi-insulating materials over 10K-Ohm cm bulk resistance
Features
- Front USB port enables easy data storage to flash drives
- MTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and Dependability
- Non-contact Measurements
- 76-300 mm Diameter Wafer Range
- Optional wafer measurement rings
- Wafer stops for exact centering
- Ethernet interface
- Full remote control software (Windows compatible)
- Optional calibration wafers
