The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability. *Gallium-Arsenide requires probe reconfiguration for semi-insulating materials over 10K-Ohm cm bulk resistance Features Front USB port enables easy data storage to flash drives MTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and Dependability Non-contact Measurements 76-300 mm Diameter Wafer Range Optional wafer measurement rings Wafer stops for exact centering Ethernet interface Full remote control software (Windows compatible) Optional calibration wafers