Momentive Performance Materials Inc. Momentive ECC4865 Silicone Sealant - Clear 40 lb Pail - ECC4865 5GP 28708

Description
Momentive clear ECC4865 silicone sealant. Minimum to maximum operating temperatures are -40 F to +392 F.
  • Momentive ECC4865 Silicone Sealant - Clear 40 lb Pail - ECC4865 5GP - ECC4865 5GP - R. S. Hughes Company, Inc.
    R. S. Hughes Company, Inc.
Description
Momentive clear ECC4865 silicone sealant. Minimum to maximum operating temperatures are -40 F to +392 F.

Suppliers

Company
Product
Description
Supplier Links
Momentive ECC4865 Silicone Sealant - Clear 40 lb Pail - ECC4865 5GP - ECC4865 5GP - R. S. Hughes Company, Inc.
R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Momentive ECC4865 Silicone Sealant - Clear 40 lb Pail - ECC4865 5GP
ECC4865 5GP
Momentive ECC4865 Silicone Sealant - Clear 40 lb Pail - ECC4865 5GP ECC4865 5GP
Momentive clear ECC4865 silicone sealant. Minimum to maximum operating temperatures are -40 F to +392 F.

Momentive clear ECC4865 silicone sealant. Minimum to maximum operating temperatures are -40 F to +392 F.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Leveling and Filling Compounds
Product Number ECC4865 5GP
Product Name Momentive ECC4865 Silicone Sealant - Clear 40 lb Pail - ECC4865 5GP
Use Temperature -40 to 392 F (-40 to 200 C)
Unlock Full Specs
to access all available technical data

Similar Products

Fillers & Putties - 4479719 - RS Components, Ltd.
RS Components, Ltd.
Fillers & Putties
4479719
Specs
Type / Form Liquid
Features Sealant
Use Temperature 122 F (50 C)
View Details
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity - EP36FR - Master Bond, Inc.
Master Bond, Inc.
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity
EP36FR
Specs
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
Composition Unfilled
View Details
Underfill Materials for Printed Circuit Boards (PCBs) - ALPHA ® HiTech ® CU31-3300 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Underfill Materials for Printed Circuit Boards (PCBs)
ALPHA ® HiTech ® CU31-3300
Specs
Industry Electronics
Elongation 10.1 %
Dielectric Strength 635 kV/in (250 kV/cm)
View Details
Wall Treatments, Sealants and Putties - - AkzoNobel N.V.
AkzoNobel N.V.
Wall Treatments, Sealants and Putties
Specs
Features Sealant (optional feature)
Substrate Compatibility Metal (optional feature); Wood (optional feature)
View Details