Momentive Performance Materials Inc. Momentive TSE3051 Clear Potting & Encapsulating Compound - 15 kg Pail 28276

Description
Momentive clear TSE3051 potting & encapsulating compound with a 2 hr @ 257F cure time.
Description
Momentive clear TSE3051 potting & encapsulating compound with a 2 hr @ 257F cure time.

Suppliers

Company
Product
Description
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Momentive TSE3051 Clear Potting & Encapsulating Compound - 15 kg Pail - TSE3051 15K - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Momentive TSE3051 Clear Potting & Encapsulating Compound - 15 kg Pail
TSE3051 15K
Momentive TSE3051 Clear Potting & Encapsulating Compound - 15 kg Pail TSE3051 15K
Momentive clear TSE3051 potting & encapsulating compound with a 2 hr @ 257F cure time.

Momentive clear TSE3051 potting & encapsulating compound with a 2 hr @ 257F cure time.

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Tse3051-15K Momentive Performance Materials - 26AK6013 - Newark, An Avnet Company
Chicago, IL, United States
Tse3051-15K Momentive Performance Materials
26AK6013
Tse3051-15K Momentive Performance Materials 26AK6013
TSE3051-15K

TSE3051-15K

Supplier's Site

Technical Specifications

  R. S. Hughes Company, Inc. Newark, An Avnet Company
Product Category Encapsulants and Potting Compounds Industrial Adhesives
Product Number TSE3051 15K 26AK6013
Product Name Momentive TSE3051 Clear Potting & Encapsulating Compound - 15 kg Pail Tse3051-15K Momentive Performance Materials
Thermal Conductivity 0.1700 W/m-K (0.0982 BTU-ft/hr-ft²-F)
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