Momentive Performance Materials Inc. Momentive TSE382 Silicone Sealant - Clear Paste 18 kg Pail - TSE382-C-18K 20915

Description
Momentive clear TSE382 silicone sealant with a 7 day cure time. Delivers great performance with tensile strength of 1.9 MPa. Minimum to maximum operating temperatures are -67 F to +392 F.
Description
Momentive clear TSE382 silicone sealant with a 7 day cure time. Delivers great performance with tensile strength of 1.9 MPa. Minimum to maximum operating temperatures are -67 F to +392 F.

Suppliers

Company
Product
Description
Supplier Links
Momentive TSE382 Silicone Sealant - Clear Paste 18 kg Pail - TSE382-C-18K - TSE382-C-18K - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Momentive TSE382 Silicone Sealant - Clear Paste 18 kg Pail - TSE382-C-18K
TSE382-C-18K
Momentive TSE382 Silicone Sealant - Clear Paste 18 kg Pail - TSE382-C-18K TSE382-C-18K
Momentive clear TSE382 silicone sealant with a 7 day cure time. Delivers great performance with tensile strength of 1.9 MPa. Minimum to maximum operating temperatures are -67 F to +392 F.

Momentive clear TSE382 silicone sealant with a 7 day cure time. Delivers great performance with tensile strength of 1.9 MPa. Minimum to maximum operating temperatures are -67 F to +392 F.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Leveling and Filling Compounds
Product Number TSE382-C-18K
Product Name Momentive TSE382 Silicone Sealant - Clear Paste 18 kg Pail - TSE382-C-18K
Use Temperature -67 to 392 F (-55 to 200 C)
Unlock Full Specs
to access all available technical data

Similar Products

Underfill Materials for Printed Circuit Boards (PCBs) - ALPHA ® HiTech ® CU21-3240 Underfill - MacDermid Alpha Electronics Solutions
Specs
Industry Automotive; Electronics
Dielectric Strength 533 kV/in (210 kV/cm)
Dielectric Constant 4.67
View Details
Tough Epoxy Polysulfide Adhesive Resists High Temperatures - EP21TPHT - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Polyphenylene Sulfide; Epoxy
Composition Unfilled
View Details
Fillers & Putties - 4479719 - RS Components, Ltd.
RS Components, Ltd.
Specs
Type / Form Liquid
Features Sealant
Use Temperature 122 F (50 C)
View Details
Wall Treatments, Sealants and Putties -  - AkzoNobel N.V.
Specs
Features Sealant (optional feature)
Substrate Compatibility Metal (optional feature); Wood (optional feature)
View Details