Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and other high technology applications. Our FaradFlex® laminates and resin coated capacitor foils provide the highest capacitance densities and most solution choices for embedded capacitance and ultra-thin material applications. In addition, FaradFlex® provides a very low impedance/ inductance power distribution path increasing the device efficiency and functionality at both lower and higher frequencies.
Applications of MC12TM, MC8TM:
Used for the most demanding decoupling applications, the combination of being extremely thin and having a higher Dk, provides the lowest level of PDN impedance and resulting lowest noise and EMI levels.
Examples: Supercomputers, servers, routers, military avionics and communications
Applications of MC16T, MC25ST, MC12TM, MC8TM:
These products are typically used for discrete embedded capacitance. FaradFlex frees up design space by eliminating the need to place discrete capacitors on the surface of the PCB, Module, or chip package. Space is a premium on many of these devices and there are few or no locations to place a capacitor with its vias, pad, and traces. By using Faradflex the device is etched into the copper and located in the substrate. It also provides a very short impedance path for the charge to the device from directly beneath it.
Examples: Memory module substrates, Folded Stacked Die packages, CA TV Filters, Power modules, Chip package substrates, RF Filter & Receiver Modules, RF Transmitter modules for WIFI & WIMAX
| Oak-Mitsui Technologies - FaradFlex® | |
|---|---|
| Product Category | Printed Circuit Substrate Materials (PCB / PWB) |
| Product Number | MC8TM, MC12TM |
| Product Name | FARADFLEX® Ultra Thin Advanced Electronic Material, MCxxTM |
| Features | Dielectric / Insulating |
