Gelest, Inc. ETHOXY TERMINATED POLYDIMETHYLSILOXANE, 5-10 cSt DMS-XE11

Description
Safety Packaging Under Nitrogen
  • ETHOXY TERMINATED POLYDIMETHYLSILOXANE, 5-10 cSt - DMS-XE11 - Gelest, Inc.
    Gelest, Inc.
Datasheet
Description
Safety Packaging Under Nitrogen
Datasheet

Suppliers

Company
Product
Description
Supplier Links
ETHOXY TERMINATED POLYDIMETHYLSILOXANE, 5-10 cSt - DMS-XE11 - Gelest, Inc.
Gelest, Inc.
Morrisville, PA, United States
ETHOXY TERMINATED POLYDIMETHYLSILOXANE, 5-10 cSt
DMS-XE11
ETHOXY TERMINATED POLYDIMETHYLSILOXANE, 5-10 cSt DMS-XE11
Safety Packaging Under Nitrogen

Safety


  • Packaging Under Nitrogen
Supplier's Site Datasheet

Technical Specifications

  Gelest, Inc.
Product Category Industrial Adhesives
Product Number DMS-XE11
Product Name ETHOXY TERMINATED POLYDIMETHYLSILOXANE, 5-10 cSt
Chemical System Silicone
Unlock Full Specs
to access all available technical data

Similar Products

UV-Curing Epoxy, NOA 1375, 6 gm Syringe - NOA-1375S - Newport MKS
Newport MKS
UV-Curing Epoxy, NOA 1375, 6 gm Syringe
NOA-1375S
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
Glue, Adhesives, Applicators - 484-S1184-KIT-1-ND - DigiKey
TE Connectivity
Glue, Adhesives, Applicators
S1184-KIT-1
Specs
Chemical System Epoxy
View Details
Heat Transfer Compound - T-85 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-85
Specs
Cure / Technology Single Component
Features Thermally Conductive
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Low Thermal Resistance Carbon Fiber Thermal Gap Pad for Semiconductor Heat Sinks - CSF45 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Low Thermal Resistance Carbon Fiber Thermal Gap Pad for Semiconductor Heat Sinks
CSF45
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details