Gelest, Inc. VINYL TERMINATED POLYDIMETHYLSILOXANE, 1,000 cSt DMS-V31

Description
Safety Packaging Under Nitrogen DMS-V31: Vinyl Terminated PDMS, 1,000 cSt (Telechelic Functional Fluid) Vinyl terminated polymers are most often employed in 2-part addition cure silicone elastomers. DMS-V31 Properties Viscosity: 1,000 cSt Molecular Weight: 28,000 g/mol Wt.% Vinyl: 0.18-0.26 Vinyl (eq/kg): 0.07-0.10
Datasheet
Description
Safety Packaging Under Nitrogen DMS-V31: Vinyl Terminated PDMS, 1,000 cSt (Telechelic Functional Fluid) Vinyl terminated polymers are most often employed in 2-part addition cure silicone elastomers. DMS-V31 Properties Viscosity: 1,000 cSt Molecular Weight: 28,000 g/mol Wt.% Vinyl: 0.18-0.26 Vinyl (eq/kg): 0.07-0.10
Datasheet

Suppliers

Company
Product
Description
Supplier Links
VINYL TERMINATED POLYDIMETHYLSILOXANE, 1,000 cSt - DMS-V31 - Gelest, Inc.
Morrisville, PA, United States
VINYL TERMINATED POLYDIMETHYLSILOXANE, 1,000 cSt
DMS-V31
VINYL TERMINATED POLYDIMETHYLSILOXANE, 1,000 cSt DMS-V31
Safety Packaging Under Nitrogen DMS-V31: Vinyl Terminated PDMS, 1,000 cSt (Telechelic Functional Fluid) Vinyl terminated polymers are most often employed in 2-part addition cure silicone elastomers. DMS-V31 Properties Viscosity: 1,000 cSt Molecular Weight: 28,000 g/mol Wt.% Vinyl: 0.18-0.26 Vinyl (eq/kg): 0.07-0.10

Safety


  • Packaging Under Nitrogen
    DMS-V31: Vinyl Terminated PDMS, 1,000 cSt (Telechelic Functional Fluid)
    Vinyl terminated polymers are most often employed in 2-part addition cure silicone elastomers.
    DMS-V31 Properties
  • Viscosity: 1,000 cSt
  • Molecular Weight: 28,000 g/mol
  • Wt.% Vinyl: 0.18-0.26
  • Vinyl (eq/kg): 0.07-0.10
Supplier's Site Datasheet

Technical Specifications

  Gelest, Inc.
Product Category Industrial Adhesives
Product Number DMS-V31
Product Name VINYL TERMINATED POLYDIMETHYLSILOXANE, 1,000 cSt
Chemical System Silicone
Unlock Full Specs
to access all available technical data

Similar Products

Double-component thermal conductive sealant gel for heat transfer - SE300AB - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Type / Form Gel
Features Thermally Conductive
View Details
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 482 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Type / Form Sheet or Film
Industry Electronics; Semiconductors, IC's
View Details
Epoxylite® - E 5526 Hi Temp Epoxy Kit - ELANTAS North America LLC
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Composition Filled
View Details
Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details