Microsemi Corp. Embedded - Embedded - System On Chip (SoC) - A2F500M3G-1FG256M A2F500M3G-1FG256M

Description
Manufacturer: Microsemi Corporation Win Source Part Number: 812208-A2F500M3G-1FG 256M Packaging: Tray Core Processor: ARM Cortex -M3 Speed: 100MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 25, FPGA - 66 RAM Size: 64KB Flash Size: 512KB Architecture: MCU, FPGA Primary Attributes: ProASIC 3 FPGA, 500K Gates, 11520 D-Flip-Flops Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -55°C ~ 125°C Manufacturer Package: 256-LBGA Popularity: Low Fake Threat In the Open Market: 84 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 90 MSL Level: 3 (168 Hours) Part Number Series: A2F500M3G
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Description
Manufacturer: Microsemi Corporation Win Source Part Number: 812208-A2F500M3G-1FG 256M Packaging: Tray Core Processor: ARM Cortex -M3 Speed: 100MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 25, FPGA - 66 RAM Size: 64KB Flash Size: 512KB Architecture: MCU, FPGA Primary Attributes: ProASIC 3 FPGA, 500K Gates, 11520 D-Flip-Flops Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -55°C ~ 125°C Manufacturer Package: 256-LBGA Popularity: Low Fake Threat In the Open Market: 84 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 90 MSL Level: 3 (168 Hours) Part Number Series: A2F500M3G
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Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - A2F500M3G-1FG256M
812208-A2F500M3G-1FG256M
Embedded - Embedded - System On Chip (SoC) - A2F500M3G-1FG256M 812208-A2F500M3G-1FG256M
Manufacturer: Microsemi Corporation Win Source Part Number: 812208-A2F500M3G-1FG 256M Packaging: Tray Core Processor: ARM Cortex -M3 Speed: 100MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 25, FPGA - 66 RAM Size: 64KB Flash Size: 512KB Architecture: MCU, FPGA Primary Attributes: ProASIC 3 FPGA, 500K Gates, 11520 D-Flip-Flops Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -55°C ~ 125°C Manufacturer Package: 256-LBGA Popularity: Low Fake Threat In the Open Market: 84 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 90 MSL Level: 3 (168 Hours) Part Number Series: A2F500M3G

Manufacturer: Microsemi Corporation
Win Source Part Number: 812208-A2F500M3G-1FG256M
Packaging: Tray
Core Processor: ARM Cortex -M3
Speed: 100MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Number of I/O: MCU - 25, FPGA - 66
RAM Size: 64KB
Flash Size: 512KB
Architecture: MCU, FPGA
Primary Attributes: ProASIC 3 FPGA, 500K Gates, 11520 D-Flip-Flops
Supplier Device Package: 256-FPBGA (17x17)
Temperature Range - Operating: -55°C ~ 125°C
Manufacturer Package: 256-LBGA
Popularity: Low
Fake Threat In the Open Market: 84 pct.
Supply and Demand Status: Limited
Manufacturer Pack Quantity: 90
MSL Level: 3 (168 Hours)
Part Number Series: A2F500M3G

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Technical Specifications

  Win Source Electronics
Product Category System on a Chip (SoC)
Product Number 812208-A2F500M3G-1FG256M
Product Name Embedded - Embedded - System On Chip (SoC) - A2F500M3G-1FG256M
Processor Core ARM
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