Microsemi Corp. Embedded - Embedded - System On Chip (SoC) - A2F200M3F-FGG256I A2F200M3F-FGG256I

Description
Manufacturer: Microsemi Corporation Win Source Part Number: 811559-A2F200M3F-FGG 256I Packaging: Tray Core Processor: ARM Cortex -M3 Speed: 80MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 25, FPGA - 66 RAM Size: 64KB Flash Size: 256KB Architecture: MCU, FPGA Primary Attributes: ProASIC 3 FPGA, 200K Gates, 4608 D-Flip-Flops Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C Manufacturer Package: 256-LBGA Popularity: Low Fake Threat In the Open Market: 60 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 90 MSL Level: 3 (168 Hours) Part Number Series: A2F200
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Description
Manufacturer: Microsemi Corporation Win Source Part Number: 811559-A2F200M3F-FGG 256I Packaging: Tray Core Processor: ARM Cortex -M3 Speed: 80MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 25, FPGA - 66 RAM Size: 64KB Flash Size: 256KB Architecture: MCU, FPGA Primary Attributes: ProASIC 3 FPGA, 200K Gates, 4608 D-Flip-Flops Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C Manufacturer Package: 256-LBGA Popularity: Low Fake Threat In the Open Market: 60 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 90 MSL Level: 3 (168 Hours) Part Number Series: A2F200
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Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - A2F200M3F-FGG256I
811559-A2F200M3F-FGG256I
Embedded - Embedded - System On Chip (SoC) - A2F200M3F-FGG256I 811559-A2F200M3F-FGG256I
Manufacturer: Microsemi Corporation Win Source Part Number: 811559-A2F200M3F-FGG 256I Packaging: Tray Core Processor: ARM Cortex -M3 Speed: 80MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 25, FPGA - 66 RAM Size: 64KB Flash Size: 256KB Architecture: MCU, FPGA Primary Attributes: ProASIC 3 FPGA, 200K Gates, 4608 D-Flip-Flops Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C Manufacturer Package: 256-LBGA Popularity: Low Fake Threat In the Open Market: 60 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 90 MSL Level: 3 (168 Hours) Part Number Series: A2F200

Manufacturer: Microsemi Corporation
Win Source Part Number: 811559-A2F200M3F-FGG256I
Packaging: Tray
Core Processor: ARM Cortex -M3
Speed: 80MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Number of I/O: MCU - 25, FPGA - 66
RAM Size: 64KB
Flash Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: ProASIC 3 FPGA, 200K Gates, 4608 D-Flip-Flops
Supplier Device Package: 256-FPBGA (17x17)
Temperature Range - Operating: -40°C ~ 100°C
Manufacturer Package: 256-LBGA
Popularity: Low
Fake Threat In the Open Market: 60 pct.
Supply and Demand Status: Limited
Manufacturer Pack Quantity: 90
MSL Level: 3 (168 Hours)
Part Number Series: A2F200

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Technical Specifications

  Win Source Electronics
Product Category System on a Chip (SoC)
Product Number 811559-A2F200M3F-FGG256I
Product Name Embedded - Embedded - System On Chip (SoC) - A2F200M3F-FGG256I
Processor Core ARM
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