Microsemi Corp. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) A2F060M3E-FGG256I

Description
Win Source Part Number: 1042111-A2F060M3E-FG G256I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: SmartFusion® Core Processor: ARM® Cortex®-M3 Speed: 80MHz Package: Tray Standard Package: 90 Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 26, FPGA - 66 RAM Size: 16KB Flash Size: 128KB Architecture: MCU, FPGA Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 64 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microsemi Corporation Other Names: A2F060M3E-FGG256I-ND ,150-A2F060M3E-FGG25 6I Base Product Number: A2F060M3E Product Status: Obsolete
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Description
Win Source Part Number: 1042111-A2F060M3E-FG G256I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: SmartFusion® Core Processor: ARM® Cortex®-M3 Speed: 80MHz Package: Tray Standard Package: 90 Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 26, FPGA - 66 RAM Size: 16KB Flash Size: 128KB Architecture: MCU, FPGA Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 64 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microsemi Corporation Other Names: A2F060M3E-FGG256I-ND ,150-A2F060M3E-FGG25 6I Base Product Number: A2F060M3E Product Status: Obsolete
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Suppliers

Company
Product
Description
Supplier Links
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1042111-A2F060M3E-FGG256I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1042111-A2F060M3E-FGG256I
Win Source Part Number: 1042111-A2F060M3E-FG G256I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: SmartFusion® Core Processor: ARM® Cortex®-M3 Speed: 80MHz Package: Tray Standard Package: 90 Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 26, FPGA - 66 RAM Size: 16KB Flash Size: 128KB Architecture: MCU, FPGA Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 64 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microsemi Corporation Other Names: A2F060M3E-FGG256I-ND ,150-A2F060M3E-FGG25 6I Base Product Number: A2F060M3E Product Status: Obsolete

Win Source Part Number: 1042111-A2F060M3E-FGG256I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: SmartFusion®
Core Processor: ARM® Cortex®-M3
Speed: 80MHz
Package: Tray
Standard Package: 90
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Number of I/O: MCU - 26, FPGA - 66
RAM Size: 16KB
Flash Size: 128KB
Architecture: MCU, FPGA
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
ECCN: 3A991D
Fake Threat In the Open Market: 64 pct.
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: Microsemi Corporation
Other Names: A2F060M3E-FGG256I-ND,150-A2F060M3E-FGG256I
Base Product Number: A2F060M3E
Product Status: Obsolete

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - A2F060M3E-FGG256I - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
A2F060M3E-FGG256I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) A2F060M3E-FGG256I
IC SOC CORTEX-M3 80MHZ 256FBGA

IC SOC CORTEX-M3 80MHZ 256FBGA

Supplier's Site
System On Chip (SoC) - A2F060M3E-FGG256I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
A2F060M3E-FGG256I
System On Chip (SoC) A2F060M3E-FGG256I
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 80MHz 256-FPBGA (17x17)

ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 80MHz 256-FPBGA (17x17)

Buy Now Datasheet

Technical Specifications

  Win Source Electronics Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1042111-A2F060M3E-FGG256I A2F060M3E-FGG256I A2F060M3E-FGG256I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC)
Processor Core ARM ARM ARM; ARM® Cortex®-M3
Package / Case Tray 256-LBGA
RAM Size 0.0160 MB 0.0160 MB 0.0160 MB
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