Category: DRAM
Manufacturer: Micron Technology Inc.
IC DRAM 16GBIT PAR 200WFBGA
LPDDR5 16G 512MX32 FBGA DDP Product overview: MT62F512M32D2DS-031 WT:B from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT62F512M32D2DS-
LPDDR5 16G 512MX32 FBGA DDP
LPDDR516G512MX32FBGA
| Win Source Electronics | DigiKey | ERSAELECTRONICS PTE. LTD. | ODG (Origin Data Global) | Newark, An Avnet Company | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 557-MT62F512M32D2DS-031WT:B-ND | 774-MT62F512M32D2DS-031 WT:B | MT62F512M32D2DS-031 WT:B | 80AH8506 | |
| Product Name | DRAM | Memory | Memory IC and Storage Component | Memory | Lpddr516G512Mx32Fbgaddp, Tray Rohs Compliant Micron |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | SDRAM - Mobile LPDDR5 | ||
| Operating Temperature | -25 to 85 C (-13 to 185 F) | -25 to 85 C (-13 to 185 F) | -25 to 85 C (-13 to 185 F) | ||
| Package Type | 200-WFBGA | BGA; Box | 200-WFBGA | ||
| Density | 16000000 kbits | 16000000 kbits |
