Micron Technology, Inc. Memory MT62F1G32D2DS-023 IT:C TR

Description
IC DRAM 32GBIT PAR 315TFBGA
  • Memory - 557-MT62F1G32D2DS-023IT:CTR-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
IC DRAM 32GBIT PAR 315TFBGA
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 557-MT62F1G32D2DS-023IT:CTR-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Memory
557-MT62F1G32D2DS-023IT:CTR-ND
Memory 557-MT62F1G32D2DS-023IT:CTR-ND
IC DRAM 32GBIT PAR 315TFBGA

IC DRAM 32GBIT PAR 315TFBGA

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Memory Chips
Product Number 557-MT62F1G32D2DS-023IT:CTR-ND
Product Name Memory
Memory Category DRAM Chip
Unlock Full Specs
to access all available technical data

Similar Products

Memory - IS43DR32160C-3DBL - Lingto Electronic Limited
Rochester Electronics
Memory
IS43DR32160C-3DBL
Specs
Memory Category DRAM; DRAM Chip
Access Time 0.4500 ns
Density 512000 kbits
View Details
Memory IC and Storage Component - 736-DP8429TD-70 - ERSAELECTRONICS PTE. LTD.
Texas Instruments
Memory IC and Storage Component
DP8429TD-70
Specs
Memory Category DRAM Chip
Operating Temperature 0 to 70 C (32 to 158 F)
Package Type Bulk
View Details
3 suppliers
Memory - 2551483 - Quarktwin Technology Ltd.
Infineon Technologies AG
Memory
2551483
View Details
Memory - SMJ416160 - Micross Components, Inc.
Micross Components, Inc.
Memory
SMJ416160
Specs
Memory Category DRAM; DRAM Chip
Access Time 70 to 80 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details