Micron Technology, Inc. DRAM MT61K512M32KPA-24:U

Description
Category: DRAM Manufacturer: Micron Technology Inc.
Request a Quote Datasheet
Description
Category: DRAM Manufacturer: Micron Technology Inc.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
DRAM -  - Win Source Electronics
Laguna Hills, CA, United States
DRAM
DRAM
Category: DRAM Manufacturer: Micron Technology Inc.

Category: DRAM
Manufacturer: Micron Technology Inc.

Buy Now
Memory IC and Storage Component - 774-MT61K512M32KPA-24:U - ERSAELECTRONICS PTE. LTD.
Singapore, Singapore
Memory IC and Storage Component
774-MT61K512M32KPA-24:U
Memory IC and Storage Component 774-MT61K512M32KPA-24:U
GDDR6 16G 512MX32 FBGA DDP Product overview: MT61K512M32KPA-24:U from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT61K512M32KPA-2 4:U can be used for catalog matching and distributor lookup.

GDDR6 16G 512MX32 FBGA DDP Product overview: MT61K512M32KPA-24:U from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT61K512M32KPA-24:U can be used for catalog matching and distributor lookup.

Supplier's Site Datasheet
GDDR6 16G 512MX32 FBGA DDP

GDDR6 16G 512MX32 FBGA DDP

Supplier's Site
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
MT61K512M32KPA-24:U
Integrated Circuits (ICs) - Memory - Memory MT61K512M32KPA-24:U
GDDR6 16G 512MX32 FBGA DDP

GDDR6 16G 512MX32 FBGA DDP

Supplier's Site

Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD. ODG (Origin Data Global) Acme Chip Technology Co., Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 774-MT61K512M32KPA-24:U MT61K512M32KPA-24:U MT61K512M32KPA-24:U
Product Name DRAM Memory IC and Storage Component Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category Volatile; DRAM Chip SGRAM - GDDR6 Volatile; DRAM Chip
Operating Temperature 0 to 95 C (32 to 203 F) 0 to 95 C (32 to 203 F)
Address Bus Width 32 bits
Package Type BGA; Box 180-TFBGA BGA; 180-FBGA (12x14)
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 540746-003-00 - Quarktwin Technology Ltd.
Infineon Technologies AG
View Details
2 suppliers
Memory - 71256L25YGI - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 25 ns
Density 256 kbits
View Details
Memory - AS4SD32M16 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SDRAM; DRAM Chip
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 256000 kbits
View Details