Micron Technology, Inc. Lpddr448G768Mx64Fbgaqdp, Tray Rohs Compliant Micron MT53E768M64D4HJ-046 WT:B

Description
LPDDR448G768MX64FBGA QDP, TRAY ROHS COMPLIANT: YES
Description
LPDDR448G768MX64FBGA QDP, TRAY ROHS COMPLIANT: YES
Datasheet
Datasheet Summary
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The LPDDR448G768Mx64Fbgaqdp is a low-power double data rate (LPDDR4/LPDDR4X) synchronous dynamic random-access memory (SDRAM) module designed for mobile applications. It operates with ultra-low voltage power supplies, specifically VDD1 ranging from 1.70V to 1.95V and VDDQ at 1.10V or a low VDDQ option of 0.60V. The module supports a frequency range of 2133 MHz to 10 MHz, achieving data rates up to 4266 Mb/s per pin. This memory device features a 16n prefetch architecture and includes eight internal banks per channel for concurrent operations. It allows programmable read and write latencies, as well as on-the-fly burst lengths of 16 or 32. The device is capable of delivering up to 8.5 GB/s per die and includes an on-chip temperature sensor for self-refresh rate control. It is packaged in a RoHS-compliant 200-ball TFBGA format, measuring 10mm x 14.5mm, and is rated for an operating temperature range of -25¬8C to +85¬8C. Engineers considering this product should evaluate its specifications against their project requirements, particularly in terms of power consumption, data rate, and thermal performance.

Datasheet Summary
Powered by GS/AI

The LPDDR448G768Mx64Fbgaqdp is a low-power double data rate (LPDDR4/LPDDR4X) synchronous dynamic random-access memory (SDRAM) module designed for mobile applications. It operates with ultra-low voltage power supplies, specifically VDD1 ranging from 1.70V to 1.95V and VDDQ at 1.10V or a low VDDQ option of 0.60V. The module supports a frequency range of 2133 MHz to 10 MHz, achieving data rates up to 4266 Mb/s per pin. This memory device features a 16n prefetch architecture and includes eight internal banks per channel for concurrent operations. It allows programmable read and write latencies, as well as on-the-fly burst lengths of 16 or 32. The device is capable of delivering up to 8.5 GB/s per die and includes an on-chip temperature sensor for self-refresh rate control. It is packaged in a RoHS-compliant 200-ball TFBGA format, measuring 10mm x 14.5mm, and is rated for an operating temperature range of -25¬8C to +85¬8C. Engineers considering this product should evaluate its specifications against their project requirements, particularly in terms of power consumption, data rate, and thermal performance.

Suppliers

Company
Product
Description
Supplier Links
Lpddr448G768Mx64Fbgaqdp, Tray Rohs Compliant Micron - 80AH8473 - Newark, An Avnet Company
Chicago, IL, United States
Lpddr448G768Mx64Fbgaqdp, Tray Rohs Compliant Micron
80AH8473
Lpddr448G768Mx64Fbgaqdp, Tray Rohs Compliant Micron 80AH8473
LPDDR448G768MX64FBGA QDP, TRAY ROHS COMPLIANT: YES

LPDDR448G768MX64FBGAQDP, TRAY ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Memory Chips
Product Number 80AH8473
Product Name Lpddr448G768Mx64Fbgaqdp, Tray Rohs Compliant Micron
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