Manufacturer: Micron Technology Inc.
Series: Automotive, AEC-Q100
Operating Temperature Range: -40°C ~ 125°C (TC)
Features: SDRAM - Mobile LPDDR4 Memory IC 24Gb (768M x 32) - 2.133 GHz 200-VFBGA (10x14.5)
Package: Tray
Package: 200-VFBGA
Mounting: Surface Mount
Part Status: Obsolete
Family Name: MT53E768
Categories: Integrated Circuits (ICs)
Case / Package: 200-VFBGA (10x14.5)
ECCN: EAR99
Popularity: Medium
Fake Threat In the Open Market: 37 pct.
Supply and Demand Status: Limited
Quantity per package: 1360
MSL Level: 3 (168 Hours)
HTSUS: 8542.32.0036
IC DRAM 24GBIT 2.133GHZ 200VFBGA
DRAM, 768M X 32BIT, -25 TO 85DEG C; DRAM Type:LPDDR4; DRAM Density:24Gbit; DRAM Memory Configuration:768M x 32bit; Clock Frequency:2.133GHz; Memory Case Style:VFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:- RoHS Compliant: Yes
IC DRAM 24GBIT 2.133GHZ 200VFBGA
SDRAM - Mobile LPDDR4 Memory IC 24Gbit 2.133 GHz 200-VFBGA (10x14.5)
| Win Source Electronics | Lingto Electronic Limited | Newark, An Avnet Company | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | MT53E768M32D4DT-046 WT:E | 80AH8457 | MT53E768M32D4DT-046 WT:E | MT53E768M32D4DT-046 WT:E | |
| Product Name | Memory - SDRAM - MT53E768M32D4DT-046 WT:E | Memory | Dram, 768M X 32Bit, -25 To 85Deg C; Dram Type Micron | Integrated Circuits (ICs) - Memory | Memory |
| Memory Category | DRAM Chip | DRAM; DRAM Chip | DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip |
| Operating Temperature | -40 to 125 C (-40 to 257 F) | -40 to 125 C (-40 to 257 F) | -40 to 125 C (-40 to 257 F) | ||
| Package Type | BGA; 200-VFBGA (10x14.5) | VFBGA | BGA | BGA; 200-VFBGA | |
| Density | 24000000 kbits | 24000000 kbits | 24000000 kbits | 24000000 kbits |
