Micron Technology, Inc. Memory MT53E384M32D2FW-046 AAT:E

Description
SDRAM - Mobile LPDDR4X Memory IC 12Gb (384M x 32) Parallel 1.066GHz 3.5ns 200-TFBGA (10x14.5)
Request a Quote Datasheet
Description
SDRAM - Mobile LPDDR4X Memory IC 12Gb (384M x 32) Parallel 1.066GHz 3.5ns 200-TFBGA (10x14.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 557-MT53E384M32D2FW-046AAT:E-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR4X Memory IC 12Gb (384M x 32) Parallel 1.066GHz 3.5ns 200-TFBGA (10x14.5)

SDRAM - Mobile LPDDR4X Memory IC 12Gb (384M x 32) Parallel 1.066GHz 3.5ns 200-TFBGA (10x14.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory MT53E384M32D2FW-046 AAT:E
IC DRAM

IC DRAM

Supplier's Site
SDRAM - Mobile LPDDR4X Memory IC 12Gbit Parallel 1.066 GHz 3.5 ns 200-TFBGA (10x14.5)

SDRAM - Mobile LPDDR4X Memory IC 12Gbit Parallel 1.066 GHz 3.5 ns 200-TFBGA (10x14.5)

Buy Now Datasheet
Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron - 80AH8391 - Newark, An Avnet Company
Chicago, IL, United States
Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron
80AH8391
Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron 80AH8391
DRAM, 384M X 32BIT, -40 TO 105DEG C; DRAM Type:LPDDR4; DRAM Density:12Gbit; DRAM Memory Configuration:384M x 32bit; Clock Frequency:2.133GHz; Memory Case Style:TFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:- RoHS Compliant: Yes

DRAM, 384M X 32BIT, -40 TO 105DEG C; DRAM Type:LPDDR4; DRAM Density:12Gbit; DRAM Memory Configuration:384M x 32bit; Clock Frequency:2.133GHz; Memory Case Style:TFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  DigiKey Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Newark, An Avnet Company
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 557-MT53E384M32D2FW-046AAT:E-ND MT53E384M32D2FW-046 AAT:E MT53E384M32D2FW-046 AAT:E 80AH8391
Product Name Memory Integrated Circuits (ICs) - Memory Memory Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type 200-TFBGA BGA BGA; 200-TFBGA TFBGA
Supply Voltage 1.06V ~ 1.17V 1.06V ~ 1.17V 1.06V ~ 1.17V
Unlock Full Specs
to access all available technical data

Similar Products

Memory - MYXxxSMSxxxxPxxxxx-xx/x - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category MRAM; STT-MRAM
Access Time 45 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Memory - JM38510/23102BFA - Quarktwin Technology Ltd.
View Details
2 suppliers
Flash Memory - 1882828 - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Bits per Word 8 bits
Pins 8
View Details