Micron Technology, Inc. Memory MT53E384M32D2FW-046 AAT:E

Description
SDRAM - Mobile LPDDR4X Memory IC 12Gb (384M x 32) Parallel 1.066GHz 3.5ns 200-TFBGA (10x14.5)
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Description
SDRAM - Mobile LPDDR4X Memory IC 12Gb (384M x 32) Parallel 1.066GHz 3.5ns 200-TFBGA (10x14.5)
Request a Quote Datasheet

Suppliers

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Product
Description
Supplier Links
Memory - 557-MT53E384M32D2FW-046AAT:E-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR4X Memory IC 12Gb (384M x 32) Parallel 1.066GHz 3.5ns 200-TFBGA (10x14.5)

SDRAM - Mobile LPDDR4X Memory IC 12Gb (384M x 32) Parallel 1.066GHz 3.5ns 200-TFBGA (10x14.5)

Buy Now Datasheet
SDRAM - Mobile LPDDR4X Memory IC 12Gbit Parallel 1.066 GHz 3.5 ns 200-TFBGA (10x14.5)

SDRAM - Mobile LPDDR4X Memory IC 12Gbit Parallel 1.066 GHz 3.5 ns 200-TFBGA (10x14.5)

Buy Now Datasheet
Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron - 80AH8391 - Newark, An Avnet Company
Chicago, IL, United States
Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron
80AH8391
Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron 80AH8391
DRAM, 384M X 32BIT, -40 TO 105DEG C; DRAM Type:LPDDR4; DRAM Density:12Gbit; DRAM Memory Configuration:384M x 32bit; Clock Frequency:2.133GHz; Memory Case Style:TFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:- RoHS Compliant: Yes

DRAM, 384M X 32BIT, -40 TO 105DEG C; DRAM Type:LPDDR4; DRAM Density:12Gbit; DRAM Memory Configuration:384M x 32bit; Clock Frequency:2.133GHz; Memory Case Style:TFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:- RoHS Compliant: Yes

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory MT53E384M32D2FW-046 AAT:E
IC DRAM

IC DRAM

Supplier's Site

Technical Specifications

  DigiKey Quarktwin Technology Ltd. Newark, An Avnet Company Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 557-MT53E384M32D2FW-046AAT:E-ND MT53E384M32D2FW-046 AAT:E 80AH8391 MT53E384M32D2FW-046 AAT:E
Product Name Memory Memory Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron Integrated Circuits (ICs) - Memory
Memory Category DRAM Chip DRAM; DRAM Chip DRAM Chip Volatile; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type 200-TFBGA BGA; 200-TFBGA TFBGA BGA
Supply Voltage 1.06V ~ 1.17V 1.06V ~ 1.17V 1.06V ~ 1.17V
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