Micron Technology, Inc. Integrated Circuits (ICs) - Memory MT53E384M32D2DS-046 AAT:E

Description
Category: Integrated Circuits (ICs)>Memory Series: Automotive, AEC-Q100 Package: Tray Standard Package: 1,360 Mounting: SMD (SMT) Technology: SDRAM - Mobile LPDDR4 Memory Type: Volatile Memory Size: 12Gb (384M x 32) Voltage - Supply: 1.1V Package / Case: 200-WFBGA Supplier Device Package: 200-WFBGA (10x14.5) Temperature Range - Operating: -40°C ~ 105°C (TC) Memory Format: DRAM Clock Frequency: 2.133 GHz Alternative Parts (Cross-Reference): MT53E384M32D2DS-046A AT:E; ECCN: EAR99 Fake Threat In the Open Market: 54 pct. MSL Level: 3 (168 Hours) HTSUS: 8542.32.0036 Mfr: Micron Technology Inc. Base Product Number: MT53E384 Product Status: Last Time Buy
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Description
Category: Integrated Circuits (ICs)>Memory Series: Automotive, AEC-Q100 Package: Tray Standard Package: 1,360 Mounting: SMD (SMT) Technology: SDRAM - Mobile LPDDR4 Memory Type: Volatile Memory Size: 12Gb (384M x 32) Voltage - Supply: 1.1V Package / Case: 200-WFBGA Supplier Device Package: 200-WFBGA (10x14.5) Temperature Range - Operating: -40°C ~ 105°C (TC) Memory Format: DRAM Clock Frequency: 2.133 GHz Alternative Parts (Cross-Reference): MT53E384M32D2DS-046A AT:E; ECCN: EAR99 Fake Threat In the Open Market: 54 pct. MSL Level: 3 (168 Hours) HTSUS: 8542.32.0036 Mfr: Micron Technology Inc. Base Product Number: MT53E384 Product Status: Last Time Buy
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Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Memory -  - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Memory
Integrated Circuits (ICs) - Memory
Category: Integrated Circuits (ICs)>Memory Series: Automotive, AEC-Q100 Package: Tray Standard Package: 1,360 Mounting: SMD (SMT) Technology: SDRAM - Mobile LPDDR4 Memory Type: Volatile Memory Size: 12Gb (384M x 32) Voltage - Supply: 1.1V Package / Case: 200-WFBGA Supplier Device Package: 200-WFBGA (10x14.5) Temperature Range - Operating: -40°C ~ 105°C (TC) Memory Format: DRAM Clock Frequency: 2.133 GHz Alternative Parts (Cross-Reference): MT53E384M32D2DS-046A AT:E; ECCN: EAR99 Fake Threat In the Open Market: 54 pct. MSL Level: 3 (168 Hours) HTSUS: 8542.32.0036 Mfr: Micron Technology Inc. Base Product Number: MT53E384 Product Status: Last Time Buy

Category: Integrated Circuits (ICs)>Memory
Series: Automotive, AEC-Q100
Package: Tray
Standard Package: 1,360
Mounting: SMD (SMT)
Technology: SDRAM - Mobile LPDDR4
Memory Type: Volatile
Memory Size: 12Gb (384M x 32)
Voltage - Supply: 1.1V
Package / Case: 200-WFBGA
Supplier Device Package: 200-WFBGA (10x14.5)
Temperature Range - Operating: -40°C ~ 105°C (TC)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Alternative Parts (Cross-Reference): MT53E384M32D2DS-046AAT:E;
ECCN: EAR99
Fake Threat In the Open Market: 54 pct.
MSL Level: 3 (168 Hours)
HTSUS: 8542.32.0036
Mfr: Micron Technology Inc.
Base Product Number: MT53E384
Product Status: Last Time Buy

Buy Now
Memory - MT53E384M32D2DS-046AAT:E-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR4 Memory IC 12Gb (384M x 32) 2.133GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 12Gb (384M x 32) 2.133GHz 200-WFBGA (10x14.5)

Buy Now Datasheet
2.133GHZ Memory IC and Storage Component - 774-MT53E384M32D2DS-046 AAT:E - ERSAELECTRONICS PTE. LTD.
Singapore
2.133GHZ Memory IC and Storage Component
774-MT53E384M32D2DS-046 AAT:E
2.133GHZ Memory IC and Storage Component 774-MT53E384M32D2DS-046 AAT:E
IC DRAM 12GBIT 2.133GHZ 200WFBGA Product overview: MT53E384M32D2DS-046 AAT:E from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E384M32D2DS- 046 AAT:E can be used for catalog matching and distributor lookup.

IC DRAM 12GBIT 2.133GHZ 200WFBGA Product overview: MT53E384M32D2DS-046 AAT:E from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E384M32D2DS-046 AAT:E can be used for catalog matching and distributor lookup.

Supplier's Site
SDRAM - Mobile LPDDR4 Memory IC 12Gbit 2.133 GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 12Gbit 2.133 GHz 200-WFBGA (10x14.5)

Buy Now
IC DRAM 12GBIT 2.133GHZ 200WFBGA

IC DRAM 12GBIT 2.133GHZ 200WFBGA

Supplier's Site
Integrated Circuits (ICs) - Memory MT53E384M32D2DS-046 AAT:E
IC DRAM 12GBIT 2.133GHZ 200WFBGA

IC DRAM 12GBIT 2.133GHZ 200WFBGA

Supplier's Site
Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron - 80AH8383 - Newark, An Avnet Company
Chicago, IL, United States
Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron
80AH8383
Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron 80AH8383
DRAM, 384M X 32BIT, -40 TO 105DEG C; DRAM Type:LPDDR4; DRAM Density:12Gbit; DRAM Memory Configuration:384M x 32bit; Clock Frequency:2.133GHz; Memory Case Style:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:- RoHS Compliant: Yes

DRAM, 384M X 32BIT, -40 TO 105DEG C; DRAM Type:LPDDR4; DRAM Density:12Gbit; DRAM Memory Configuration:384M x 32bit; Clock Frequency:2.133GHz; Memory Case Style:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics DigiKey ERSAELECTRONICS PTE. LTD. Quarktwin Technology Ltd. Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited Newark, An Avnet Company
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number MT53E384M32D2DS-046AAT:E-ND 774-MT53E384M32D2DS-046 AAT:E MT53E384M32D2DS-046 AAT:E MT53E384M32D2DS-046 AAT:E MT53E384M32D2DS-046 AAT:E 80AH8383
Product Name Integrated Circuits (ICs) - Memory Memory 2.133GHZ Memory IC and Storage Component Memory Memory Integrated Circuits (ICs) - Memory Dram, 384M X 32Bit, -40 To 105Deg C; Dram Type Micron
Memory Category Volatile; DRAM Chip DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Supply Voltage 1.1V 1.1V 1.1V 1.1V
Package Type 200-WFBGA BGA; Tray BGA; 200-WFBGA BGA WFBGA
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