IC DRAM 64GBIT PAR 200TFBGA
LPDDR4 64G 2GX32 FBGA Product overview: MT53E2G32D4DE-046 WT:C from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E2G32D4DE-04
Category: DRAM
Manufacturer: Micron Technology Inc.
LPDDR4 64G 2GX32 FBGA ROHS COMPLIANT: YES
| DigiKey | ERSAELECTRONICS PTE. LTD. | Win Source Electronics | Newark, An Avnet Company | ODG (Origin Data Global) | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 557-MT53E2G32D4DE-046WT:C-ND | 774-MT53E2G32D4DE-046 WT:C | 25AK7969 | MT53E2G32D4DE-046 WT:C | |
| Product Name | Memory | Memory IC and Storage Component | DRAM | Lpddr4 64G 2Gx32 Fbga Rohs Compliant Micron | Memory |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | SDRAM - Mobile LPDDR4X | ||
| Operating Temperature | -25 to 85 C (-13 to 185 F) | -25 to 85 C (-13 to 185 F) | -25 to 85 C (-13 to 185 F) | ||
| Package Type | 200-TFBGA | BGA; Box | 200-TFBGA | ||
| Supply Voltage | 1.06V ~ 1.17V | 1.06V ~ 1.17V | 1.06V ~ 1.17V | ||
| Access Time | 3.5 ns | 3.5 ns |
