Category: DRAM
Manufacturer: Micron Technology Inc.
IC DRAM 8GBIT PAR 200TFBGA
LPDDR4 8G 256MX32 FBGA DDP Product overview: MT53E256M32D2FW-046 AUT:B from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E256M32D2FW-
SDRAM - Mobile LPDDR4 Memory IC 8Gbit Parallel 2.133 GHz 3.5 ns 200-TFBGA (10x14.5)
LPDDR48G256MX32FBGAD
| Win Source Electronics | DigiKey | ERSAELECTRONICS PTE. LTD. | Quarktwin Technology Ltd. | Newark, An Avnet Company | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 557-MT53E256M32D2FW-046AUT:B-ND | 774-MT53E256M32D2FW-046 AUT:B | MT53E256M32D2FW-046 AUT:B | 80AH8373 | |
| Product Name | DRAM | Memory | Memory IC and Storage Component | Memory | Lpddr48G256Mx32Fbgaddp, Tray Rohs Compliant Micron |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | ||
| Operating Temperature | -40 to 125 C (-40 to 257 F) | -40 to 125 C (-40 to 257 F) | -40 to 125 C (-40 to 257 F) | ||
| Package Type | 200-TFBGA | BGA; Box | BGA; 200-TFBGA | ||
| Supply Voltage | 1.06V ~ 1.17V | 1.06V ~ 1.17V | 1.06V ~ 1.17V | ||
| Access Time | 3.5 ns | 3.5 ns |
