Micron Technology, Inc. Integrated Circuits (ICs) - Memory MT53E256M32D2DS-053 WT:B TR

Description
Category: Integrated Circuits (ICs)>Memory Package: Tape & Reel (TR) Standard Package: 2,000 Mounting: SMD (SMT) Technology: SDRAM - Mobile LPDDR4 Memory Type: Volatile Memory Size: 8Gb (256M x 32) Voltage - Supply: 1.1V Package / Case: 200-WFBGA Supplier Device Package: 200-WFBGA (10x14.5) Temperature Range - Operating: -30°C ~ 85°C (TC) Memory Format: DRAM Clock Frequency: 1.866 GHz ECCN: EAR99 Fake Threat In the Open Market: 59 pct. MSL Level: 3 (168 Hours) HTSUS: 8542.32.0036 Mfr: Micron Technology Inc. Base Product Number: MT53E256 Product Status: Obsolete
Request a Quote Datasheet
Description
Category: Integrated Circuits (ICs)>Memory Package: Tape & Reel (TR) Standard Package: 2,000 Mounting: SMD (SMT) Technology: SDRAM - Mobile LPDDR4 Memory Type: Volatile Memory Size: 8Gb (256M x 32) Voltage - Supply: 1.1V Package / Case: 200-WFBGA Supplier Device Package: 200-WFBGA (10x14.5) Temperature Range - Operating: -30°C ~ 85°C (TC) Memory Format: DRAM Clock Frequency: 1.866 GHz ECCN: EAR99 Fake Threat In the Open Market: 59 pct. MSL Level: 3 (168 Hours) HTSUS: 8542.32.0036 Mfr: Micron Technology Inc. Base Product Number: MT53E256 Product Status: Obsolete
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Memory -  - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Memory
Integrated Circuits (ICs) - Memory
Category: Integrated Circuits (ICs)>Memory Package: Tape & Reel (TR) Standard Package: 2,000 Mounting: SMD (SMT) Technology: SDRAM - Mobile LPDDR4 Memory Type: Volatile Memory Size: 8Gb (256M x 32) Voltage - Supply: 1.1V Package / Case: 200-WFBGA Supplier Device Package: 200-WFBGA (10x14.5) Temperature Range - Operating: -30°C ~ 85°C (TC) Memory Format: DRAM Clock Frequency: 1.866 GHz ECCN: EAR99 Fake Threat In the Open Market: 59 pct. MSL Level: 3 (168 Hours) HTSUS: 8542.32.0036 Mfr: Micron Technology Inc. Base Product Number: MT53E256 Product Status: Obsolete

Category: Integrated Circuits (ICs)>Memory
Package: Tape & Reel (TR)
Standard Package: 2,000
Mounting: SMD (SMT)
Technology: SDRAM - Mobile LPDDR4
Memory Type: Volatile
Memory Size: 8Gb (256M x 32)
Voltage - Supply: 1.1V
Package / Case: 200-WFBGA
Supplier Device Package: 200-WFBGA (10x14.5)
Temperature Range - Operating: -30°C ~ 85°C (TC)
Memory Format: DRAM
Clock Frequency: 1.866 GHz
ECCN: EAR99
Fake Threat In the Open Market: 59 pct.
MSL Level: 3 (168 Hours)
HTSUS: 8542.32.0036
Mfr: Micron Technology Inc.
Base Product Number: MT53E256
Product Status: Obsolete

Buy Now
Memory - MT53E256M32D2DS-053WT:BTR-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) 1.866GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) 1.866GHz 200-WFBGA (10x14.5)

Buy Now Datasheet
1.866GHZ Memory IC and Storage Component - 774-MT53E256M32D2DS-053 WT:B TR - ERSAELECTRONICS PTE. LTD.
Singapore, Singapore
1.866GHZ Memory IC and Storage Component
774-MT53E256M32D2DS-053 WT:B TR
1.866GHZ Memory IC and Storage Component 774-MT53E256M32D2DS-053 WT:B TR
IC DRAM 8GBIT 1.866GHZ 200WFBGA Product overview: MT53E256M32D2DS-053 WT:B TR from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.866GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.866GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E256M32D2DS- 053 WT:B TR can be used for catalog matching and distributor lookup.

IC DRAM 8GBIT 1.866GHZ 200WFBGA Product overview: MT53E256M32D2DS-053 WT:B TR from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.866GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.866GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E256M32D2DS-053 WT:B TR can be used for catalog matching and distributor lookup.

Supplier's Site
SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.866 GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.866 GHz 200-WFBGA (10x14.5)

Buy Now Datasheet
IC DRAM 8GBIT 1.866GHZ 200WFBGA

IC DRAM 8GBIT 1.866GHZ 200WFBGA

Supplier's Site
Integrated Circuits (ICs) - Memory MT53E256M32D2DS-053 WT:B TR
IC DRAM 8GBIT 1.866GHZ 200WFBGA

IC DRAM 8GBIT 1.866GHZ 200WFBGA

Supplier's Site

Technical Specifications

  Win Source Electronics DigiKey ERSAELECTRONICS PTE. LTD. Quarktwin Technology Ltd. Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number MT53E256M32D2DS-053WT:BTR-ND 774-MT53E256M32D2DS-053 WT:B TR MT53E256M32D2DS-053 WT:B TR MT53E256M32D2DS-053 WT:B TR MT53E256M32D2DS-053 WT:B TR
Product Name Integrated Circuits (ICs) - Memory Memory 1.866GHZ Memory IC and Storage Component Memory Memory Integrated Circuits (ICs) - Memory
Memory Category Volatile; DRAM Chip DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Operating Temperature -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F)
Supply Voltage 1.1V 1.1V 1.1V 1.1V
Package Type 200-WFBGA BGA; Tape & Reel (TR) BGA; 200-WFBGA BGA
Density 8000000 kbits 8000000 kbits 8000000 kbits 8000000 kbits
Unlock Full Specs
to access all available technical data

Similar Products

Memory - AS8SLC512K32PECA - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SRAM; SRAM Chip
Access Time 12 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Memory - 6116LA35SO - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 35 ns
Density 16 kbits
View Details