Micron Technology, Inc. Memory - SDRAM - MT53E256M32D2DS-053 AUT:B MT53E256M32D2DS-053 AUT:B

Description
Manufacturer: Micron Technology Inc. Series: Automotive, AEC-Q100 Operating Temperature Range: -40°C ~ 125°C (TC) Features: SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) - 200-WFBGA (10x14.5) Package: 200-WFBGA Package: Tray Mounting: Surface Mount Family Name: MT53E256 Categories: Integrated Circuits (ICs) Case / Package: 200-WFBGA (10x14.5) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 32 pct. Supply and Demand Status: Balance Quantity per package: 1360 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 35 Weeks HTSUS: 8542.32.0036
Request a Quote Datasheet
Description
Manufacturer: Micron Technology Inc. Series: Automotive, AEC-Q100 Operating Temperature Range: -40°C ~ 125°C (TC) Features: SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) - 200-WFBGA (10x14.5) Package: 200-WFBGA Package: Tray Mounting: Surface Mount Family Name: MT53E256 Categories: Integrated Circuits (ICs) Case / Package: 200-WFBGA (10x14.5) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 32 pct. Supply and Demand Status: Balance Quantity per package: 1360 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 35 Weeks HTSUS: 8542.32.0036
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - SDRAM - MT53E256M32D2DS-053 AUT:B -  - Win Source Electronics
Laguna Hills, CA, United States
Memory - SDRAM - MT53E256M32D2DS-053 AUT:B
Memory - SDRAM - MT53E256M32D2DS-053 AUT:B
Manufacturer: Micron Technology Inc. Series: Automotive, AEC-Q100 Operating Temperature Range: -40°C ~ 125°C (TC) Features: SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) - 200-WFBGA (10x14.5) Package: 200-WFBGA Package: Tray Mounting: Surface Mount Family Name: MT53E256 Categories: Integrated Circuits (ICs) Case / Package: 200-WFBGA (10x14.5) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 32 pct. Supply and Demand Status: Balance Quantity per package: 1360 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 35 Weeks HTSUS: 8542.32.0036

Manufacturer: Micron Technology Inc.
Series: Automotive, AEC-Q100
Operating Temperature Range: -40°C ~ 125°C (TC)
Features: SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) - 200-WFBGA (10x14.5)
Package: 200-WFBGA
Package: Tray
Mounting: Surface Mount
Family Name: MT53E256
Categories: Integrated Circuits (ICs)
Case / Package: 200-WFBGA (10x14.5)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 32 pct.
Supply and Demand Status: Balance
Quantity per package: 1360
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 35 Weeks
HTSUS: 8542.32.0036

Buy Now
1.866GHZ Memory IC and Storage Component - 774-MT53E256M32D2DS-053 AUT:B - ERSAELECTRONICS PTE. LTD.
Singapore
1.866GHZ Memory IC and Storage Component
774-MT53E256M32D2DS-053 AUT:B
1.866GHZ Memory IC and Storage Component 774-MT53E256M32D2DS-053 AUT:B
IC DRAM 8GBIT 1.866GHZ 200WFBGA Product overview: MT53E256M32D2DS-053 AUT:B from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.866GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.866GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E256M32D2DS- 053 AUT:B can be used for catalog matching and distributor lookup.

IC DRAM 8GBIT 1.866GHZ 200WFBGA Product overview: MT53E256M32D2DS-053 AUT:B from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.866GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.866GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E256M32D2DS-053 AUT:B can be used for catalog matching and distributor lookup.

Supplier's Site
SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.866 GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.866 GHz 200-WFBGA (10x14.5)

Buy Now
IC DRAM 8GBIT 1.866GHZ 200WFBGA

IC DRAM 8GBIT 1.866GHZ 200WFBGA

Supplier's Site
Dram, 256M X 32Bit, -40 To 125Deg C; Dram Type Micron - 80AH8367 - Newark, An Avnet Company
Chicago, IL, United States
Dram, 256M X 32Bit, -40 To 125Deg C; Dram Type Micron
80AH8367
Dram, 256M X 32Bit, -40 To 125Deg C; Dram Type Micron 80AH8367
DRAM, 256M X 32BIT, -40 TO 125DEG C; DRAM Type:LPDDR4; DRAM Density:8Gbit; DRAM Memory Configuration:256M x 32bit; Clock Frequency:1.866GHz; Memory Case Style:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:535ps RoHS Compliant: Yes

DRAM, 256M X 32BIT, -40 TO 125DEG C; DRAM Type:LPDDR4; DRAM Density:8Gbit; DRAM Memory Configuration:256M x 32bit; Clock Frequency:1.866GHz; Memory Case Style:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:535ps RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD. Quarktwin Technology Ltd. Lingto Electronic Limited Newark, An Avnet Company
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 774-MT53E256M32D2DS-053 AUT:B MT53E256M32D2DS-053 AUT:B MT53E256M32D2DS-053 AUT:B 80AH8367
Product Name Memory - SDRAM - MT53E256M32D2DS-053 AUT:B 1.866GHZ Memory IC and Storage Component Memory Memory Dram, 256M X 32Bit, -40 To 125Deg C; Dram Type Micron
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip DRAM Chip
Operating Temperature -40 to 125 C (-40 to 257 F) -40 to 125 C (-40 to 257 F) -40 to 125 C (-40 to 257 F)
Package Type BGA; 200-WFBGA (10x14.5) BGA; Tray BGA; 200-WFBGA WFBGA
Access Time 3.5 ns 0.5350 ns
Address Bus Width 32 bits
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