Micron Technology, Inc. Memory MT53E256M32D2DS-053 AAT:B TR

Description
SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.866 GHz 200-WFBGA (10x14.5)
Description
SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.866 GHz 200-WFBGA (10x14.5)

Suppliers

Company
Product
Description
Supplier Links
SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.866 GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.866 GHz 200-WFBGA (10x14.5)

Buy Now
IC DRAM 8GBIT 1.866GHZ 200WFBGA

IC DRAM 8GBIT 1.866GHZ 200WFBGA

Supplier's Site
Integrated Circuits (ICs) - Memory MT53E256M32D2DS-053 AAT:B TR
IC DRAM 8GBIT 1.866GHZ 200WFBGA

IC DRAM 8GBIT 1.866GHZ 200WFBGA

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT53E256M32D2DS-053 AAT:B TR MT53E256M32D2DS-053 AAT:B TR MT53E256M32D2DS-053 AAT:B TR
Product Name Memory Memory Integrated Circuits (ICs) - Memory
Memory Category DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Density 8000000 kbits 8000000 kbits 8000000 kbits
Unlock Full Specs
to access all available technical data

Similar Products

Flash Memory - 1882547 - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Number of Words 256 k
Bits per Word 8 bits
View Details
FIFOs Memory - SN74ACT7200L20NP - Quarktwin Technology Ltd.
Specs
Operating Temperature 0 to 70 C (32 to 158 F)
Density 2 kbits
Package Type DIP; 28-DIP (0.300\", 7.62mm)
View Details
Memory - MYX4DD3K512M72PBG2 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DDR3
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 4096000 kbits
View Details
Memory - 71256S35TDB - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 35 ns
Density 256 kbits
View Details