IC DRAM 8GBIT 2.133GHZ 200WFBGA Product overview: MT53E256M32D2DS-046 AIT:B from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E256M32D2DS-
Series: *
Categories: Memory
IC DRAM 8GBIT 2.133GHZ 200WFBGA
DRAM, 256M X 32BIT, -40 TO 95DEG C; DRAM Type:LPDDR4; DRAM Density:8Gbit; DRAM Memory Configuration:256M x 32bit; Clock Frequency:2.133GHz; Memory Case Style:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:468ps RoHS Compliant: Yes
DRAM, 256M X 32BIT, -40 TO 95DEG C ROHS COMPLIANT: YES
IC DRAM 8GBIT 2.133GHZ 200WFBGA
IC DRAM 8GBIT 2.133GHZ 200WFBGA
SDRAM - Mobile LPDDR4 Memory IC 8Gbit 2.133 GHz 200-WFBGA (10x14.5)
| ERSAELECTRONICS PTE. LTD. | Win Source Electronics | Lingto Electronic Limited | Newark, An Avnet Company | Newark, An Avnet Company | ODG (Origin Data Global) | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-MT53E256M32D2DS-046 AIT:B | MT53E256M32D2DS-046 AIT:B | 83AH2736 | 32AJ7545 | MT53E256M32D2DS-046 AIT:B | MT53E256M32D2DS-046 AIT:B | MT53E256M32D2DS-046 AIT:B | |
| Product Name | 2.133GHZ Memory IC and Storage Component | Memory - DDR - MT53E256M32D2DS-046 AIT:B | Memory | Dram, 256M X 32Bit, -40 To 95Deg C; Dram Type Micron | Dram, 256M X 32Bit, -40 To 95Deg C Rohs Compliant Micron | Memory | Integrated Circuits (ICs) - Memory | Memory |
| Memory Category | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM Chip | DRAM Chip | SDRAM - Mobile LPDDR4; DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | |
| Access Time | 3.5 ns | 0.4680 ns | ||||||
| Operating Temperature | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | ||||
| Address Bus Width | 32 bits | |||||||
| Package Type | BGA; Tray | WFBGA | 200-WFBGA | BGA | BGA; 200-WFBGA |