Micron Technology, Inc. 2.133GHZ Memory IC and Storage Component MT53E1G32D4NQ-046 WT:E

Description
IC DRAM 32GBIT 2.133GHZ FBGA Product overview: MT53E1G32D4NQ-046 WT:E from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E1G32D4NQ-04 6 WT:E can be used for catalog matching and distributor lookup.
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Description
IC DRAM 32GBIT 2.133GHZ FBGA Product overview: MT53E1G32D4NQ-046 WT:E from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E1G32D4NQ-04 6 WT:E can be used for catalog matching and distributor lookup.
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Suppliers

Company
Product
Description
Supplier Links
2.133GHZ Memory IC and Storage Component - 774-MT53E1G32D4NQ-046 WT:E - ERSAELECTRONICS PTE. LTD.
Singapore, Singapore
2.133GHZ Memory IC and Storage Component
774-MT53E1G32D4NQ-046 WT:E
2.133GHZ Memory IC and Storage Component 774-MT53E1G32D4NQ-046 WT:E
IC DRAM 32GBIT 2.133GHZ FBGA Product overview: MT53E1G32D4NQ-046 WT:E from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E1G32D4NQ-04 6 WT:E can be used for catalog matching and distributor lookup.

IC DRAM 32GBIT 2.133GHZ FBGA Product overview: MT53E1G32D4NQ-046 WT:E from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E1G32D4NQ-046 WT:E can be used for catalog matching and distributor lookup.

Supplier's Site
Memory - DDR - MT53E1G32D4NQ-046 WT:E -  - Win Source Electronics
Laguna Hills, CA, United States
Memory - DDR - MT53E1G32D4NQ-046 WT:E
Memory - DDR - MT53E1G32D4NQ-046 WT:E
Manufacturer: Micron Technology Inc. Operating Temperature Range: -30°C ~ 85°C (TC) Features: SDRAM - Mobile LPDDR4 Memory IC 32Gb (1G x 32) - 2.133 GHz Package: Box Family Name: MT53E1 Categories: Integrated Circuits (ICs) Popularity: High Fake Threat In the Open Market: 95 pct. Supply and Demand Status: Balance Quantity per package: 1360

Manufacturer: Micron Technology Inc.
Operating Temperature Range: -30°C ~ 85°C (TC)
Features: SDRAM - Mobile LPDDR4 Memory IC 32Gb (1G x 32) - 2.133 GHz
Package: Box
Family Name: MT53E1
Categories: Integrated Circuits (ICs)
Popularity: High
Fake Threat In the Open Market: 95 pct.
Supply and Demand Status: Balance
Quantity per package: 1360

Buy Now
Lpddr432G1Gx32Fbgawtqdp, Tray Micron - 80AH8277 - Newark, An Avnet Company
Chicago, IL, United States
Lpddr432G1Gx32Fbgawtqdp, Tray Micron
80AH8277
Lpddr432G1Gx32Fbgawtqdp, Tray Micron 80AH8277
LPDDR432G1GX32FBGAWT QDP, TRAY

LPDDR432G1GX32FBGAWTQDP, TRAY

Supplier's Site
Integrated Circuits (ICs) - Memory - Memory - MT53E1G32D4NQ-046 WT:E - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT53E1G32D4NQ-046 WT:E
Integrated Circuits (ICs) - Memory - Memory MT53E1G32D4NQ-046 WT:E
IC DRAM 32GBIT 2.133GHZ FBGA

IC DRAM 32GBIT 2.133GHZ FBGA

Supplier's Site
SDRAM - Mobile LPDDR4 Memory IC 32Gbit 2.133 GHz

SDRAM - Mobile LPDDR4 Memory IC 32Gbit 2.133 GHz

Buy Now
IC DRAM 32GBIT 2.133GHZ FBGA

IC DRAM 32GBIT 2.133GHZ FBGA

Supplier's Site
LPDDR4 32G 1GX32 FBGA WT QDP

LPDDR4 32G 1GX32 FBGA WT QDP

Supplier's Site

Technical Specifications

  ERSAELECTRONICS PTE. LTD. Win Source Electronics Newark, An Avnet Company Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. ODG (Origin Data Global) Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 774-MT53E1G32D4NQ-046 WT:E 80AH8277 MT53E1G32D4NQ-046 WT:E MT53E1G32D4NQ-046 WT:E MT53E1G32D4NQ-046 WT:E MT53E1G32D4NQ-046 WT:E
Product Name 2.133GHZ Memory IC and Storage Component Memory - DDR - MT53E1G32D4NQ-046 WT:E Lpddr432G1Gx32Fbgawtqdp, Tray Micron Integrated Circuits (ICs) - Memory - Memory Memory Memory Memory
Memory Category Volatile; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip SDRAM - Mobile LPDDR4; DRAM Chip DRAM; DRAM Chip
Operating Temperature -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F)
Address Bus Width 32 bits
Package Type BGA; Box
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