Manufacturer: Micron Technology Inc.
Operating Temperature Range: -30°C ~ 85°C (TC)
Features: SDRAM - Mobile LPDDR4 Memory IC 32Gb (512M x 64) - 2.133 GHz 376-WFBGA (14x14)
Package: 376-WFBGA
Package: Tray
Mounting: Surface Mount
Family Name: MT53D512
Categories: Integrated Circuits (ICs)
Case / Package: 376-WFBGA (14x14)
ECCN: EAR99
Popularity: Medium
Fake Threat In the Open Market: 73 pct.
Supply and Demand Status: Limited
Quantity per package: 1190
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 35 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036
IC DRAM 32GBIT 2.133GHZ 376WFBGA Product overview: MT53D512M64D4NZ-046 WT:E from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53D512M64D4NZ-
IC DRAM 32GBIT 2133MHZ 376WFBGA
IC DRAM 32GBIT 2.133GHZ 376WFBGA
SDRAM - Mobile LPDDR4 Memory IC 32Gbit 2.133 GHz 376-WFBGA (14x14)
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | Lingto Electronic Limited | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-MT53D512M64D4NZ-046 WT:E | MT53D512M64D4NZ-046 WT:E | MT53D512M64D4NZ-046 WT:E | MT53D512M64D4NZ-046 WT:E | |
| Product Name | Memory - SDRAM - MT53D512M64D4NZ-046 WT:E | 2.133GHZ Memory IC and Storage Component | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip |
| Operating Temperature | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | ||
| Package Type | BGA; 376-WFBGA (14x14) | BGA; Tray | BGA; 376-WFBGA |
