Micron Technology, Inc. Memory MT53D512M32D2NP-062 WT:D TR

Description
IC DRAM 16GBIT 1600MHZ 200WFBGA
Description
IC DRAM 16GBIT 1600MHZ 200WFBGA

Suppliers

Company
Product
Description
Supplier Links
IC DRAM 16GBIT 1600MHZ 200WFBGA

IC DRAM 16GBIT 1600MHZ 200WFBGA

Supplier's Site
SDRAM - Mobile LPDDR4 Memory IC 16Gbit 1.6 GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 16Gbit 1.6 GHz 200-WFBGA (10x14.5)

Buy Now
Integrated Circuits (ICs) - Memory - Memory - MT53D512M32D2NP-062 WT:D TR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT53D512M32D2NP-062 WT:D TR
Integrated Circuits (ICs) - Memory - Memory MT53D512M32D2NP-062 WT:D TR
IC DRAM 16GBIT 1.6GHZ 200WFBGA

IC DRAM 16GBIT 1.6GHZ 200WFBGA

Supplier's Site

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT53D512M32D2NP-062 WT:D TR MT53D512M32D2NP-062 WT:D TR MT53D512M32D2NP-062 WT:D TR
Product Name Memory Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Density 16000000 kbits 16000000 kbits 16000000 kbits
Operating Temperature -30 to 85 C (-22 to 185 F)
Unlock Full Specs
to access all available technical data

Similar Products

 - LP3913SQ-AA/NOPB - Rochester Electronics
Texas Instruments
Specs
Memory Category Flash
Package Type WQFN48
View Details
Flash Memory - 1882527 - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Bits per Word 8 bits
Package Type SOIC
View Details
Memory - SMJ416160 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DRAM; DRAM Chip
Access Time 70 to 80 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Memory - 520966230646 - Lingto Electronic Limited
Infineon Technologies AG
View Details
2 suppliers