Micron Technology, Inc. Memory - SDRAM - MT53D512M32D2DS-053 AAT:D MT53D512M32D2DS-053 AAT:D

Description
Manufacturer: Micron Technology Inc. Series: Automotive, AEC-Q100 Operating Temperature Range: -40°C ~ 105°C (TC) Features: SDRAM - Mobile LPDDR4 Memory IC 16Gb (512M x 32) - 1.866 GHz 200-WFBGA (10x14.5) Package: 200-WFBGA Package: Tray Mounting: Surface Mount Family Name: MT53D512 Categories: Integrated Circuits (ICs) Case / Package: 200-WFBGA (10x14.5) ECCN: EAR99 Popularity: Medium Fake Threat In the Open Market: 79 pct. Supply and Demand Status: Limited Quantity per package: 1360 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 35 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0036
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Description
Manufacturer: Micron Technology Inc. Series: Automotive, AEC-Q100 Operating Temperature Range: -40°C ~ 105°C (TC) Features: SDRAM - Mobile LPDDR4 Memory IC 16Gb (512M x 32) - 1.866 GHz 200-WFBGA (10x14.5) Package: 200-WFBGA Package: Tray Mounting: Surface Mount Family Name: MT53D512 Categories: Integrated Circuits (ICs) Case / Package: 200-WFBGA (10x14.5) ECCN: EAR99 Popularity: Medium Fake Threat In the Open Market: 79 pct. Supply and Demand Status: Limited Quantity per package: 1360 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 35 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0036
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Suppliers

Company
Product
Description
Supplier Links
Memory - SDRAM - MT53D512M32D2DS-053 AAT:D -  - Win Source Electronics
Laguna Hills, CA, United States
Memory - SDRAM - MT53D512M32D2DS-053 AAT:D
Memory - SDRAM - MT53D512M32D2DS-053 AAT:D
Manufacturer: Micron Technology Inc. Series: Automotive, AEC-Q100 Operating Temperature Range: -40°C ~ 105°C (TC) Features: SDRAM - Mobile LPDDR4 Memory IC 16Gb (512M x 32) - 1.866 GHz 200-WFBGA (10x14.5) Package: 200-WFBGA Package: Tray Mounting: Surface Mount Family Name: MT53D512 Categories: Integrated Circuits (ICs) Case / Package: 200-WFBGA (10x14.5) ECCN: EAR99 Popularity: Medium Fake Threat In the Open Market: 79 pct. Supply and Demand Status: Limited Quantity per package: 1360 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 35 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0036

Manufacturer: Micron Technology Inc.
Series: Automotive, AEC-Q100
Operating Temperature Range: -40°C ~ 105°C (TC)
Features: SDRAM - Mobile LPDDR4 Memory IC 16Gb (512M x 32) - 1.866 GHz 200-WFBGA (10x14.5)
Package: 200-WFBGA
Package: Tray
Mounting: Surface Mount
Family Name: MT53D512
Categories: Integrated Circuits (ICs)
Case / Package: 200-WFBGA (10x14.5)
ECCN: EAR99
Popularity: Medium
Fake Threat In the Open Market: 79 pct.
Supply and Demand Status: Limited
Quantity per package: 1360
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 35 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036

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1.866GHZ Memory IC and Storage Component - 774-MT53D512M32D2DS-053 AAT:D - ERSAELECTRONICS PTE. LTD.
Singapore
1.866GHZ Memory IC and Storage Component
774-MT53D512M32D2DS-053 AAT:D
1.866GHZ Memory IC and Storage Component 774-MT53D512M32D2DS-053 AAT:D
IC DRAM 16GBIT 1.866GHZ 200WFBGA Product overview: MT53D512M32D2DS-053 AAT:D from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.866GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.866GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53D512M32D2DS- 053 AAT:D can be used for catalog matching and distributor lookup.

IC DRAM 16GBIT 1.866GHZ 200WFBGA Product overview: MT53D512M32D2DS-053 AAT:D from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.866GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.866GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53D512M32D2DS-053 AAT:D can be used for catalog matching and distributor lookup.

Supplier's Site
IC DRAM 16GBIT 1866MHZ 200WFBGA

IC DRAM 16GBIT 1866MHZ 200WFBGA

Supplier's Site
IC DRAM 16GBIT 1866MHZ 200WFBGA

IC DRAM 16GBIT 1866MHZ 200WFBGA

Supplier's Site
Integrated Circuits (ICs) - Memory - Memory - MT53D512M32D2DS-053 AAT:D - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT53D512M32D2DS-053 AAT:D
Integrated Circuits (ICs) - Memory - Memory MT53D512M32D2DS-053 AAT:D
IC DRAM 16GBIT 1.866GHZ 200WFBGA

IC DRAM 16GBIT 1.866GHZ 200WFBGA

Supplier's Site
Dram, 512M X 32Bit, -40 To 105Deg C; Dram Type Micron - 80AH8246 - Newark, An Avnet Company
Chicago, IL, United States
Dram, 512M X 32Bit, -40 To 105Deg C; Dram Type Micron
80AH8246
Dram, 512M X 32Bit, -40 To 105Deg C; Dram Type Micron 80AH8246
DRAM, 512M X 32BIT, -40 TO 105DEG C; DRAM Type:LPDDR4; DRAM Density:16Gbit; DRAM Memory Configuration:512M x 32bit; Clock Frequency:1.866GHz; Memory Case Style:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:- RoHS Compliant: Yes

DRAM, 512M X 32BIT, -40 TO 105DEG C; DRAM Type:LPDDR4; DRAM Density:16Gbit; DRAM Memory Configuration:512M x 32bit; Clock Frequency:1.866GHz; Memory Case Style:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:- RoHS Compliant: Yes

Supplier's Site
SDRAM - Mobile LPDDR4 Memory IC 16Gbit 1.866 GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 16Gbit 1.866 GHz 200-WFBGA (10x14.5)

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Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD. ODG (Origin Data Global) Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited Newark, An Avnet Company Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 774-MT53D512M32D2DS-053 AAT:D MT53D512M32D2DS-053 AAT:D MT53D512M32D2DS-053 AAT:D MT53D512M32D2DS-053 AAT:D 80AH8246 MT53D512M32D2DS-053 AAT:D
Product Name Memory - SDRAM - MT53D512M32D2DS-053 AAT:D 1.866GHZ Memory IC and Storage Component Memory Memory Integrated Circuits (ICs) - Memory - Memory Dram, 512M X 32Bit, -40 To 105Deg C; Dram Type Micron Memory
Memory Category DRAM Chip Volatile; DRAM Chip SDRAM - Mobile LPDDR4; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip DRAM Chip DRAM; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type BGA; 200-WFBGA (10x14.5) BGA; Tray 200-WFBGA BGA WFBGA BGA; 200-WFBGA
Access Time 3.5 ns
Address Bus Width 32 bits
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