Micron Technology, Inc. Memory MT53D384M32D2DS-053 XT:E TR

Description
SDRAM - Mobile LPDDR4 Memory IC 12Gbit 1.866 GHz 200-WFBGA (10x14.5)
Description
SDRAM - Mobile LPDDR4 Memory IC 12Gbit 1.866 GHz 200-WFBGA (10x14.5)

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SDRAM - Mobile LPDDR4 Memory IC 12Gbit 1.866 GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 12Gbit 1.866 GHz 200-WFBGA (10x14.5)

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Integrated Circuits (ICs) - Memory - Memory - MT53D384M32D2DS-053 XT:E TR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT53D384M32D2DS-053 XT:E TR
Integrated Circuits (ICs) - Memory - Memory MT53D384M32D2DS-053 XT:E TR
IC DRAM 12GBIT 1.866GHZ 200WFBGA

IC DRAM 12GBIT 1.866GHZ 200WFBGA

Supplier's Site
IC DRAM 12GBIT 1866MHZ 200WFBGA

IC DRAM 12GBIT 1866MHZ 200WFBGA

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT53D384M32D2DS-053 XT:E TR MT53D384M32D2DS-053 XT:E TR MT53D384M32D2DS-053 XT:E TR
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category DRAM; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip
Operating Temperature -30 to 105 C (-22 to 221 F)
Density 12000000 kbits 12000000 kbits 12000000 kbits
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