Micron Technology, Inc. Memory MT53B2G32D8QD-062 WT:D

Description
LPDDR4 64G 2GX32 FBGA 8DP
  • Memory - MT53B2G32D8QD-062 WT:D - Lingto Electronic Limited
    Lingto Electronic Limited
  • Memory - MT53B2G32D8QD-062 WT:D - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Description
LPDDR4 64G 2GX32 FBGA 8DP

Suppliers

Company
Product
Description
Supplier Links
Memory - MT53B2G32D8QD-062 WT:D - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Memory
MT53B2G32D8QD-062 WT:D
Memory MT53B2G32D8QD-062 WT:D
LPDDR4 64G 2GX32 FBGA 8DP

LPDDR4 64G 2GX32 FBGA 8DP

Supplier's Site
Memory - MT53B2G32D8QD-062 WT:D - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory
MT53B2G32D8QD-062 WT:D
Memory MT53B2G32D8QD-062 WT:D
SDRAM - Mobile LPDDR4 Memory IC 64Gbit 1.6 GHz

SDRAM - Mobile LPDDR4 Memory IC 64Gbit 1.6 GHz

Buy Now

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips
Product Number MT53B2G32D8QD-062 WT:D MT53B2G32D8QD-062 WT:D
Product Name Memory Memory
Memory Category DRAM; DRAM Chip DRAM; DRAM Chip
Unlock Full Specs
to access all available technical data

Similar Products

Logic - FIFOs Memory - 67C4013-10NL - Lingto Electronic Limited
Rochester Electronics
Logic - FIFOs Memory
67C4013-10NL
Specs
Data Rate 10 MHz
Operating Current 35 mA
View Details
Logic - Logic - FIFOs Memory - 40105BE - 052142-40105BE - Win Source Electronics
Texas Instruments
Logic - Logic - FIFOs Memory - 40105BE
40105BE
Specs
Memory Category FIFO
Operating Temperature -55 to 125 C (-67 to 257 F)
Package Type DIP; 16-PDIP
View Details
Memory - AS4C1259 - Micross Components, Inc.
Micross Components, Inc.
Memory
AS4C1259
Specs
Memory Category DRAM; DRAM Chip
Access Time 100 to 150 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
SDRAM - 2420768P - RS Components, Ltd.
RS Components, Ltd.
SDRAM
2420768P
Specs
Memory Category DRAM Chip
Access Time 20 ns
Operating Temperature -40 C (-40 F)
View Details