Manufacturer: Micron Technology Inc.
Operating Temperature Range: -30°C ~ 85°C (TC)
Features: SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) - 1.6 GHz 200-WFBGA (10x14.5)
Package: Tray
Package: 200-WFBGA
Mounting: Surface Mount
Part Status: Obsolete
Family Name: MT53B256
Categories: Integrated Circuits (ICs)
Case / Package: 200-WFBGA (10x14.5)
ECCN: EAR99
Popularity: Medium
Fake Threat In the Open Market: 32 pct.
Supply and Demand Status: Limited
Quantity per package: 1360
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036
IC DRAM 8GBIT 1.6GHZ 200WFBGA Product overview: MT53B256M32D1NP-062 WT:C from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.6GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.6GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53B256M32D1NP-
SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.6 GHz 200-WFBGA (10x14.5)
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| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | Quarktwin Technology Ltd. | Lingto Electronic Limited | ODG (Origin Data Global) | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-MT53B256M32D1NP-062 WT:C | MT53B256M32D1NP-062 WT:C | MT53B256M32D1NP-062 WT:C | MT53B256M32D1NP-062 WT:C | MT53B256M32D1NP-062 WT:C | |
| Product Name | Memory - SDRAM - MT53B256M32D1NP-062 WT:C | 1.6GHZ Memory IC and Storage Component | Memory | Memory | Memory | Integrated Circuits (ICs) - Memory - Memory |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip | SDRAM - Mobile LPDDR4; DRAM Chip | Volatile; DRAM Chip |
| Operating Temperature | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | ||
| Package Type | BGA; 200-WFBGA (10x14.5) | BGA; Tray | BGA; 200-WFBGA | 200-WFBGA |
