IC DRAM 8GBIT 1.6GHZ 200WFBGA Product overview: MT53B256M32D1DS-062 AIT:C from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.6GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.6GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53B256M32D1DS-
IC DRAM 8GBIT 1.6GHZ 200WFBGA
Series: *
Categories: Memory
SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.6 GHz 200-WFBGA (10x14.5)
IC DRAM 8GBIT 1.6GHZ 200WFBGA
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DRAM, 256M X 32BIT, -40 TO 105DEG C; DRAM Type:LPDDR4; DRAM Density:8Gbit; DRAM Memory Configuration:256M x 32bit; Clock Frequency:-; Memory Case Style:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:-; Access Time:-; Product Range:- RoHS Compliant: Yes
| ERSAELECTRONICS PTE. LTD. | ODG (Origin Data Global) | Win Source Electronics | Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | Lingto Electronic Limited | Newark, An Avnet Company | |
|---|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-MT53B256M32D1DS-062 AIT:C | MT53B256M32D1DS-062 AIT:C | MT53B256M32D1DS-062 AIT:C | MT53B256M32D1DS-062 AIT:C | MT53B256M32D1DS-062 AIT:C | 80AH8201 | |
| Product Name | 1.6GHZ Memory IC and Storage Component | Memory | Memory - DDR - MT53B256M32D1DS-062 AIT:C | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory | Dram, 256M X 32Bit, -40 To 105Deg C; Dram Type Micron |
| Memory Category | Volatile; DRAM Chip | SDRAM - Mobile LPDDR4; DRAM Chip | DRAM; DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM Chip | |
| Operating Temperature | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | ||||
| Package Type | BGA; Tray | 200-WFBGA | BGA; 200-WFBGA | WFBGA | |||
| Supply Voltage | 1.1V | 1.1V | 1.1V | Surface Mount |