Micron Technology, Inc. Memory MT52L1G32D4PG-093 WT ES:B

Description
SDRAM - Mobile LPDDR3 Memory IC 32Gbit 1067 MHz 178-FBGA (12x11.5)
Description
SDRAM - Mobile LPDDR3 Memory IC 32Gbit 1067 MHz 178-FBGA (12x11.5)

Suppliers

Company
Product
Description
Supplier Links
SDRAM - Mobile LPDDR3 Memory IC 32Gbit 1067 MHz 178-FBGA (12x11.5)

SDRAM - Mobile LPDDR3 Memory IC 32Gbit 1067 MHz 178-FBGA (12x11.5)

Buy Now
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT52L1G32D4PG-093 WT ES:B
Integrated Circuits (ICs) - Memory - Memory MT52L1G32D4PG-093 WT ES:B
IC DRAM 32GBIT 1067MHZ 178FBGA

IC DRAM 32GBIT 1067MHZ 178FBGA

Supplier's Site
IC DRAM 32GBIT 1067MHZ 178FBGA

IC DRAM 32GBIT 1067MHZ 178FBGA

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT52L1G32D4PG-093 WT ES:B MT52L1G32D4PG-093 WT ES:B MT52L1G32D4PG-093 WT ES:B
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category DRAM; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip
Operating Temperature -30 to 85 C (-22 to 185 F)
Density 32000000 kbits 32000000 kbits 32000000 kbits
Unlock Full Specs
to access all available technical data

Similar Products

Memory - AS8F512K32 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category FLASH
Access Time 70 to 150 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
CD54HC40105 High Speed CMOS Logic 4-Bit by 16-Word FIFO Register - CD54HC40105F3A - Texas Instruments
Specs
Memory Category FIFO
Package Type CDIP
View Details
3 suppliers
Memory - 71024S12TYI - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 12 ns
Density 1000 kbits
View Details