IC DRAM 288MBIT PARALLEL 144UBGA Product overview: MT49H8M36BM-33:B TR from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT49H8M36BM-33:B
Manufacturer: Micron Technology Inc.
Packaging: Reel - TR
Mounting: SMD (SMT)
Technology: DRAM
Memory Type: Volatile
Memory Size: 288Mb (8M x 36)
Access Time: 20ns
Categories: Integrated Circuits
Temperature Range - Operating: 0°C to 95°C (TC)
Case / Package: 144-μBGA (18.5x11)
Supply Voltage - Operating: 1.7 V to 1.9 V
Memory Format: DRAM
Max Frequency: 300MHz
Popularity: Medium
Fake Threat In the Open Market: 64 pct.
Supply and Demand Status: Balance
IC DRAM 288MBIT PARALLEL 144UBGA
IC DRAM 288MBIT PARALLEL 144UBGA
DRAM Memory IC 288Mbit Parallel 300 MHz 20 ns 144-µBGA (18.5x11)
| ERSAELECTRONICS PTE. LTD. | Win Source Electronics | Lingto Electronic Limited | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-MT49H8M36BM-33:B TR | MT49H8M36BM-33:B TR | MT49H8M36BM-33:B TR | MT49H8M36BM-33:B TR | |
| Product Name | Memory IC and Storage Component | Memory - SDRAM - MT49H8M36BM-33:B TR | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory |
| Memory Category | Volatile; DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns | |
| Operating Temperature | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | ||
| Package Type | BGA; Tape & Reel (TR) | BGA; 144-μBGA (18.5x11) | BGA | BGA; 144-TFBGA |
