Manufacturer: Micron Technology Inc.
Operating Temperature Range: 0°C ~ 85°C (TC)
Features: SDRAM - DDR2 Memory IC 1Gb (256M x 4) Parallel 333 MHz 450 ps 60-FBGA (8x10)
Package: Tray
Package: 60-TFBGA
Mounting: Surface Mount
Part Status: Obsolete
Family Name: MT47H256M4
Categories: Integrated Circuits (ICs)
Case / Package: 60-FBGA (8x10)
ECCN: EAR99
Popularity: Medium
Fake Threat In the Open Market: 52 pct.
Supply and Demand Status: Limited
Quantity per package: 1000
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.32.0032
IC DRAM 1GBIT PARALLEL 60FBGA Product overview: MT47H256M4CF-3:H from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT47H256M4CF-3:H
SDRAM - DDR2 Memory IC 1Gb (256M x 4) Parallel 333MHz 450ps 60-FBGA (8x10)
IC DRAM 1GBIT PARALLEL 60FBGA
IC DRAM 1GBIT PARALLEL 60FBGA
SDRAM - DDR2 Memory IC 1Gbit Parallel 333 MHz 450 ps 60-FBGA (8x10)
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | DigiKey | Shenzhen Shengyu Electronics Technology Limited | Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-MT47H256M4CF-3:H | MT47H256M4CF-3:H-ND | MT47H256M4CF-3:H | MT47H256M4CF-3:H | MT47H256M4CF-3:H | |
| Product Name | Memory - SDRAM - MT47H256M4CF-3:H | Memory IC and Storage Component | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory | Memory |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip |
| Operating Temperature | 0 to 85 C (32 to 185 F) | 0 to 85 C (32 to 185 F) | 0 to 85 C (32 to 185 F) | 0 to 85 C (32 to 185 F) | ||
| Package Type | BGA; 60-FBGA (8x10) | BGA; Tray | 60-TFBGA | BGA | BGA; 60-TFBGA | |
| Access Time | 0.4500 ns | 0.4500 ns | 0.4500 ns |
