Micron Technology, Inc. Memory MT42L32M16D1AB-3 WT:A TR

Description
IC DRAM 512MBIT PARALLEL 121FBGA
Description
IC DRAM 512MBIT PARALLEL 121FBGA
Datasheet
Datasheet Summary
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The MT42L32M16D1AB-3 WT:A TR is a 512Mb Mobile LPDDR2 SDRAM memory device from Quarktwin Technology Ltd. It operates with ultra-low voltage power supplies, specifically V_DD2 and V_DDCA/V_DDQ ranging from 1.14V to 1.30V, and V_DD1 from 1.70V to 1.95V. The device supports a clock frequency range of 400,Äì10 MHz, translating to a data rate range of 800,Äì20 Mb/s per pin. This memory features a four-bit prefetch DDR architecture and includes four internal banks for concurrent operations. It supports multiplexed, double data rate command and address inputs, with commands entered on every clock edge. The device also offers programmable read and write latencies, burst lengths of 4, 8, or 16, and includes an on-chip temperature sensor for self-refresh rate control. Additional features include partial-array self-refresh, deep power-down mode, selectable output drive strength, and clock stop capability. The memory is packaged in a 121-ball FBGA format measuring 6.5mm x 8mm and is RoHS-compliant. The operating temperature range is from -25¬8C to +85¬8C, making it suitable for various applications in mobile devices.

Datasheet Summary
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The MT42L32M16D1AB-3 WT:A TR is a 512Mb Mobile LPDDR2 SDRAM memory device from Quarktwin Technology Ltd. It operates with ultra-low voltage power supplies, specifically V_DD2 and V_DDCA/V_DDQ ranging from 1.14V to 1.30V, and V_DD1 from 1.70V to 1.95V. The device supports a clock frequency range of 400,Äì10 MHz, translating to a data rate range of 800,Äì20 Mb/s per pin. This memory features a four-bit prefetch DDR architecture and includes four internal banks for concurrent operations. It supports multiplexed, double data rate command and address inputs, with commands entered on every clock edge. The device also offers programmable read and write latencies, burst lengths of 4, 8, or 16, and includes an on-chip temperature sensor for self-refresh rate control. Additional features include partial-array self-refresh, deep power-down mode, selectable output drive strength, and clock stop capability. The memory is packaged in a 121-ball FBGA format measuring 6.5mm x 8mm and is RoHS-compliant. The operating temperature range is from -25¬8C to +85¬8C, making it suitable for various applications in mobile devices.

Suppliers

Company
Product
Description
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IC DRAM 512MBIT PARALLEL 121FBGA

IC DRAM 512MBIT PARALLEL 121FBGA

Supplier's Site Datasheet
SDRAM - Mobile LPDDR2 Memory IC 512Mbit Parallel 333 MHz 121-FBGA (6.5x8)

SDRAM - Mobile LPDDR2 Memory IC 512Mbit Parallel 333 MHz 121-FBGA (6.5x8)

Buy Now Datasheet
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT42L32M16D1AB-3 WT:A TR
Integrated Circuits (ICs) - Memory - Memory MT42L32M16D1AB-3 WT:A TR
IC DRAM 512MBIT PARALLEL 121FBGA

IC DRAM 512MBIT PARALLEL 121FBGA

Supplier's Site

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT42L32M16D1AB-3 WT:A TR MT42L32M16D1AB-3 WT:A TR MT42L32M16D1AB-3 WT:A TR
Product Name Memory Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Density 512000 kbits 512000 kbits 512000 kbits
Operating Temperature -30 to 85 C (-22 to 185 F)
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