Micron Technology, Inc. Memory MT29F512G08EMCBBJ5-6:B.001

Description
IC FLASH 512GBIT PARALLEL 167MHZ
Datasheet
Description
IC FLASH 512GBIT PARALLEL 167MHZ
Datasheet

Suppliers

Company
Product
Description
Supplier Links
IC FLASH 512GBIT PARALLEL 167MHZ

IC FLASH 512GBIT PARALLEL 167MHZ

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - Memory - MT29F512G08EMCBBJ5-6:B.001 - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
MT29F512G08EMCBBJ5-6:B.001
Integrated Circuits (ICs) - Memory - Memory MT29F512G08EMCBBJ5-6:B.001
IC FLASH 512GBIT PAR 132TBGA

IC FLASH 512GBIT PAR 132TBGA

Supplier's Site
FLASH - NAND (TLC) Memory IC 512Gbit Parallel 167 MHz 132-TBGA (12x18)

FLASH - NAND (TLC) Memory IC 512Gbit Parallel 167 MHz 132-TBGA (12x18)

Buy Now

Technical Specifications

  Lingto Electronic Limited Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT29F512G08EMCBBJ5-6:B.001 MT29F512G08EMCBBJ5-6:B.001 MT29F512G08EMCBBJ5-6:B.001
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category Flash; Flash Flash; Non-Volatile Flash; FLASH
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 71024S12Y - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 12 ns
Density 1000 kbits
View Details
FIFOs Memory - SN74ACT7200L20NP - Quarktwin Technology Ltd.
Specs
Operating Temperature 0 to 70 C (32 to 158 F)
Density 2 kbits
Package Type DIP; 28-DIP (0.300\", 7.62mm)
View Details
Flash Memory - 1882769P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Density 2048000 kbits
Package Type SOIC; SOIC
View Details