Micron Technology, Inc. Memory MT29F32G08CBECBL73A3WC1

Description
IC FLASH 32GBIT PARALLEL DIE
  • Memory - MT29F32G08CBECBL73A3WC1 - Lingto Electronic Limited
    Lingto Electronic Limited
  • Memory - MT29F32G08CBECBL73A3WC1 - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Datasheet
Description
IC FLASH 32GBIT PARALLEL DIE
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - MT29F32G08CBECBL73A3WC1 - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Memory
MT29F32G08CBECBL73A3WC1
Memory MT29F32G08CBECBL73A3WC1
IC FLASH 32GBIT PARALLEL DIE

IC FLASH 32GBIT PARALLEL DIE

Supplier's Site Datasheet
Memory - MT29F32G08CBECBL73A3WC1 - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory
MT29F32G08CBECBL73A3WC1
Memory MT29F32G08CBECBL73A3WC1
FLASH - NAND Memory IC 32Gbit Parallel Die

FLASH - NAND Memory IC 32Gbit Parallel Die

Buy Now

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips
Product Number MT29F32G08CBECBL73A3WC1 MT29F32G08CBECBL73A3WC1
Product Name Memory Memory
Memory Category Flash; Flash Flash; FLASH
Unlock Full Specs
to access all available technical data

Similar Products

Rochester Electronics
Memory
24AA01/SN
Specs
Memory Category EEPROM; EEPROM
Access Time 3500 ns
Density 1 kbits
View Details
Memory - 553395-001-00 - Lingto Electronic Limited
Infineon Technologies AG
Memory
553395-001-00
View Details
2 suppliers
Memory - RAM - MT5C2568C-20/XT - 1231193-MT5C2568C-20/XT - Win Source Electronics
Micross Components, Inc.
Memory - RAM - MT5C2568C-20/XT
MT5C2568C-20/XT
Specs
Memory Category SRAM Chip
Operating Temperature -55 C (-67 F)
Density 256 kbits
View Details
2 suppliers
SN74ACT2229 256 x 1 x 2 dual independent synchronous FIFO memories - SN74ACT2229DWR - Texas Instruments
Texas Instruments
SN74ACT2229 256 x 1 x 2 dual independent synchronous FIFO memories
SN74ACT2229DWR
Specs
Memory Category FIFO
Package Type SOIC
View Details
5 suppliers