Micron Technology, Inc. Integrated Circuits (ICs) - Memory - Memory MT29F2T08EELCHD4-M:C

Description
TLC 2T 256GX8 FBGA DDP
Description
TLC 2T 256GX8 FBGA DDP

Suppliers

Company
Product
Description
Supplier Links
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
MT29F2T08EELCHD4-M:C
Integrated Circuits (ICs) - Memory - Memory MT29F2T08EELCHD4-M:C
TLC 2T 256GX8 FBGA DDP

TLC 2T 256GX8 FBGA DDP

Supplier's Site

Technical Specifications

  Acme Chip Technology Co., Limited
Product Category Memory Chips
Product Number MT29F2T08EELCHD4-M:C
Product Name Integrated Circuits (ICs) - Memory - Memory
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 28C64A-35B/XA - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category EEPROM; EEPROM
Density 64 kbits
View Details
Memory - AS4C1259 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DRAM; DRAM Chip
Access Time 100 to 150 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Memory IC and Storage Component - 736-DP8419V-70 - ERSAELECTRONICS PTE. LTD.
Specs
Memory Category DRAM Chip
Operating Temperature 0 to 70 C (32 to 158 F)
Package Type Bulk
View Details
2 suppliers
Flash Memory - 1882648P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Density 1024000 kbits
Package Type SOIC; SOIC
View Details