Micron Technology, Inc. Integrated Circuits (ICs) - Memory - Memory MT29F2G08ABBGAM79A3WC1

Description
IC FLASH 2GBIT PARALLEL DIE
Datasheet
Description
IC FLASH 2GBIT PARALLEL DIE
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT29F2G08ABBGAM79A3WC1
Integrated Circuits (ICs) - Memory - Memory MT29F2G08ABBGAM79A3WC1
IC FLASH 2GBIT PARALLEL DIE

IC FLASH 2GBIT PARALLEL DIE

Supplier's Site
IC FLASH 2GBIT PARALLEL WAFER

IC FLASH 2GBIT PARALLEL WAFER

Supplier's Site Datasheet
FLASH - NAND Memory IC 2Gbit Parallel Die

FLASH - NAND Memory IC 2Gbit Parallel Die

Buy Now

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT29F2G08ABBGAM79A3WC1 MT29F2G08ABBGAM79A3WC1 MT29F2G08ABBGAM79A3WC1
Product Name Integrated Circuits (ICs) - Memory - Memory Memory Memory
Memory Category Flash; Non-Volatile Flash; Flash Flash; FLASH
Unlock Full Specs
to access all available technical data

Similar Products

Logic - FIFOs Memory - 67C4013-10N - Lingto Electronic Limited
Specs
Data Rate 10 MHz
Operating Current 35 mA
View Details
Memory - AS8SLC128K32 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SRAM; SRAM Chip
Access Time 10 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Memory IC and Storage Component - 736-DP8409AD - ERSAELECTRONICS PTE. LTD.
Specs
Memory Category DRAM Chip
Operating Temperature 0 to 70 C (32 to 158 F)
Package Type Bulk
View Details
2 suppliers
Flash Memory - 1882727P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Density 2048000 kbits
Package Type WSON
View Details